Characterization of Constrained Sintering of Powders on Solid Substrate

Abstract:

Nowadays, sintering is a very useful technique to fabricate metal, ceramic and composites parts for different applications. This phenomenon has been extensively studied over 50 years and, most of the research related to it used a model based on two contacting particles. However, just a few jobs were focused on the powder sintering on a solid substrate. This work investigates the effect of two parameters; substrate shape and inclusion of the reinforced particles on the evolving microstructure during sintering of particles on a rigid substrate. Powders and solid bars of copper are used as a model material and particles such as tungsten carbide (WC) as reinforcing particles. Sintering was performed in an electrical furnace at 1050 °C under reducing atmosphere. The progress on sintering was evaluated by measuring the relative density close and far from the solid substrate by means of the image analysis from pictures taken by scanning electronic microscope (SEM). The effects on the constraint sintering were also identified. Heterogeneous densification and delamination of the film from the substrate were observed as densification increased which by the way is reduced by the inclusion of the reinforced particles.

• Periodical: Materials Science Forum (Volume 793)
• Pages: 135-141
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.793.135
• Online since: May 2014
• Authors: L. Olmos*, J. Lemus-Ruiz, Héctor Javier Vergara-Hernández, O. Jimenez, J.M.L. Salgado, J.J. Tena-Martinez
• Keywords: Constraint Sintering, Copper Powders, Delamination, MMC Films, Sintering

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