The Effect of Silicon Nitride Addition on Microstructure and Microhardness of SN100C Solder Alloy Using Powder Metallurgy

Mohd Izrul Izwan Ramli; Norainiza Saud; Mohd Arif Anuar Mohd Salleh; Mohd Nazree Derman; Rita Mohd Said; Norhayanti Nasir

doi:10.4028/www.scientific.net/MSF.803.228

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HomeMaterials Science ForumMaterials Science Forum Vol. 803The Effect of Silicon Nitride Addition on...

The Effect of Silicon Nitride Addition on Microstructure and Microhardness of SN100C Solder Alloy Using Powder Metallurgy

Abstract:

The effect of Si₃N₄ particulate addition on the commercial SN100C solder alloy has been investigated. The SN100C/Si₃N₄composite solder was fabricated via powder metallurgy (PM) technique. In this study five different Si₃N₄composition which have been chosen were (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %).The results showed that Si₃N₄ particulate has remain as foreign particles and precipitate at the grain boundaries thus improved the physical properties of the composite solder compared to monolithic solder alloy. The addition of 1.0 wt. % Si₃N₄ give highest hardness value to the composite solder.

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Periodical:

Materials Science Forum (Volume 803)

Pages:

228-232

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.803.228

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Online since:

August 2014

Authors:

Mohd Izrul Izwan Ramli*, Norainiza Saud, Mohd Arif Anuar Mohd Salleh, Mohd Nazree Derman, Rita Mohd Said, Norhayanti Nasir

Keywords:

Composite Solder, Lead-Free, Powder metallurgy, Silicon Nitride, SN100C

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