Development of Low Cost Sn-0.7Cu Base Composite Solder for High Temperature Application

Zawawi Mahim; Norainiza Saud; Nurul Razliana Abdul Razak

doi:10.4028/www.scientific.net/MSF.803.239

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HomeMaterials Science ForumMaterials Science Forum Vol. 803Development of Low Cost Sn-0.7Cu Base Composite...

Development of Low Cost Sn-0.7Cu Base Composite Solder for High Temperature Application

Abstract:

This research has investigated the advantages of Sn-0.7Cu composite solder compared to conventional Sn-0.7Cu solder. The method used for fabricating the composite solder is a powder metallurgy (PM) technique. SiC and Al particles were added to Sn-0.7Cu powder during the mixing process. The Sn-0.7Cu solder composite that reinforced with 0.25 wt% of SiC and 0.5 wt% of Al, were successfully synthesized via PM technique. The result showed that the addition of SiC and Al were improving the mechanical properties and thermal stability of the solder as well as reduces the material cost.

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Periodical:

Materials Science Forum (Volume 803)

Pages:

239-242

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.803.239

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Online since:

August 2014

Authors:

Zawawi Mahim*, Norainiza Saud, Nurul Razliana Abdul Razak

Keywords:

Composite Solder, High Temperature Application, Low Cost, Powder metallurgy, Sn-0.7Cu Base

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