Investigation of Typical Bonding Faults of Plated Al Sheets Developed during Rolling

Abstract:

In this study the typical bonding faults of three layer-plated aluminum sheets are investigated. The bonding was performed between AlMn1Si0.8 and AlSi10 alloys using hot rolling (a VON ROLL experimental duo mill). The experimental temperatures were 460, 480 and 500 °C. T-peel test provided a good description about the quality of bonding. Structure analysis was also performed by light microscopy to detect typical bonding faults. The aim of this investigation is to produce some typical bonding faults and find the cause of formation. The influence of the rolling temperature and surface roughness on the bonding was also analyzed. Rolling schedule and the role of first pass on the development of perfect bonding were experimentally determined.

• Periodical: Materials Science Forum (Volume 812)
• Pages: 387-392
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.812.387
• Online since: February 2015
• Authors: Gábor Szabó, Valéria Mertinger
• Keywords: Rolling , AlMn1Si0.8, AlSi10, Aluminum-Plating Technology, Bond Development, Bonding Fault, Experimental Duo Mill, Hot Rolling, Plated by Rolling, Plating with Mechanical Press, Pressure Welding, Sandwich Sheet Rolling, Welding by Rolling

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