Thermophysical Properties of Molybdenum Copper Multilayer Composites for Thermal Management Applications

Abstract:

The key properties of materials used for thermal management in electronics are thermal conductivity and the coefficient of thermal expansion. These properties can be tailored by stacking molybdenum and copper layers. Here, molybdenum copper multilayer composites with varying copper content, from 63 to 88 wt%, have been investigated. It is demonstrated, that thermal conductivity and coefficient of thermal expansion, can be adjusted by the copper content. Two flash methods for measuring the thermal conductivity are compared and the validity of the results is discussed since measurements on thin materials with strong anisotropy require a certain setup of the measurement device. For the studied compositions the thermal conductivity was determined to be between 220 to 270 W/m/K and the coefficient of thermal expansion between 6.1 to 11.5 ppm/K.

• Periodical: Materials Science Forum (Volumes 825-826)
• Pages: 297-304
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.825-826.297
• Online since: July 2015
• Authors: Martin Seiss*, Tobias Mrotzek, Norbert Dreer, Wolfram Knabl
• Keywords: CMC, Coefficient of Thermal Expansion, Multilayer Composite, SCMC, Thermal Conductivity, Thermal Management

References

[1] W. Martienssen, H. Warlimont, Springer Handbook of Condensed Matter and Materials Data, Springer, Berlin Heidelberg, (2005).

DOI: 10.1007/3-540-30437-1

[2] J. A. Shields Jr., Consultants' Corner, Int. J. Powder Metall. 50(2) (2014) 9-15.

[3] W. Buck, S. Rudtsch, Thermal Properties, in: H. Czichos, T. Saito, L. Smith (Eds. ), Springer Handbook of Materials Measurement Methods, Springer, 2006, pp.399-429.

DOI: 10.1007/978-3-540-30300-8_8

[4] W. J. Parker, R. J. Jenkins, C. P. Butler, G. L. Abott, Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity, J. Appl. Phys. 32(9) (1961) 1679-1684.

DOI: 10.1063/1.1728417

[5] H. J. Lee, R. E. Taylor, Determination of Thermophysical Properties of Layered Composites by Flash Method, in: P. G. Klemens, T. K. Chu (Eds. ), Thermal Conductivity 14, Springer, 1976, pp.423-434.

DOI: 10.1007/978-1-4899-3751-3_58

[6] ASTM Standard E 1461-07, Standard Test Method for Thermal Diffusivity by the Flash Method, ASTM International, West Conshohocken, PA, (2008).

[7] P. Schoderböck, H. Klocker, L. S. Siegel, G. Seeber, Evaluation of the Thermal Diffusivity of Thin Specimens from Laser Flash Data, Int. J. Thermophys. 30 (2009) 599-607.

DOI: 10.1007/s10765-009-0561-y

[8] G. K. White, S. J. Collocott, Heat Capacity of Reference Materials: Cu and W, J. Phys. Chem. Ref. Data 13(4) (1984) 1251-1257.

DOI: 10.1063/1.555728

[9] C. W. Hall, Laws and Models: Science, Engineering, and Technology, CRC Press, 1999, p.251.

[10] D. P. H. Hasselman, L. F. Johnson, Effective Thermal Conductivity of Composites with Interfacial Thermal Barrier Resistance, J. Compos. Mater. 21(6) (1987) 508-515.

DOI: 10.1177/002199838702100602