Uniform Deposition of Chemical Vapor Deposition Diamond Films on Slender Tungsten Wires

Abstract:

In the present study, high-quality chemical vapor deposition (CVD) micro-crystalline diamond (MCD) film was successfully deposited on the surface of the Φ0.5 mm×120 mm tungsten wire using a special designed graphitic jig for supporting the substrate and a two-step deposition procedure for guaranteeing the uniformity of as-deposited diamond film. It is proved that as-deposited film indeed presented much more uniform thickness than that obtained using a conventional jig described in the previous literature, and a very thick WC interlayer spontaneously formed between the substrate and the diamond film, which together with as-deposited MCD film have significant effects on mechanical properties of the wire. Generally speaking, the coated wire remains extremely high surface hardness of the MCD film and considerable toughness of the substrate, along with favorable film-substrate adhesion. It is recognized that these the coated tungsten wires have broad application prospects, but the technologies for depositing diamond films that are thick enough on even longer and thinner wires still need further investigation.

• Periodical: Materials Science Forum (Volume 848)
• Pages: 618-623
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.848.618
• Online since: March 2016
• Authors: Xin Chang Wang, Xiao Tian Shen, Tian Qi Zhao, Fang Hong Sun, Bin Shen
• Keywords: Chemical Vapor Deposition, Diamond Film, Tungsten Wire, Uniformity

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