Fast Preparation of Ultrathin FIB Lamellas for MEMs-Based In Situ TEM Experiments

Abstract:

The preparation of thin lamellas by focused ion beam (FIB) for MEMS-based in situ TEM experiments is time consuming. Typically, the lamellas are of ~5μm*10μm and have a thickness less than 100nm. Here we demonstrate a fast lamellas’ preparation method using special fast cutting by FIB of samples prepared by conventional TEM sample preparation by argon ion milling or electrochemical polishing methods. This method has been applied successfully on various materials, such as ductile metallic alloy Ti₆₈Ta₂₇Al₅, brittle ceramics K_0.5Na_0.5NbO₃-6%LiNbO₃ and semiconductor Si. The thickness of the lamellas depends on the original TEM sample.

• Periodical: Materials Science Forum (Volume 850)
• Pages: 722-727
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.850.722
• Online since: March 2016
• Authors: Hui Wang, Shang Gang Xiao, Qiang Xu, Tao Zhang, Henny Zandbergen
• Keywords: Fast Lamellas Preparation, Focused Ion Beam, HREM, In Situ TEM Heating Experiments

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