Parametric Study of DIC Technology for Strain Distribution of CuZn30 during Micro-Bending Process

Li Jie Wang; Brad Kinsey

doi:10.4028/www.scientific.net/MSF.861.222

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HomeMaterials Science ForumMaterials Science Forum Vol. 861Parametric Study of DIC Technology for Strain...

Parametric Study of DIC Technology for Strain Distribution of CuZn30 during Micro-Bending Process

Abstract:

In this paper, digital image correlation (DIC) technology and equipment were applied to research strain distribution of CuZn30 metal sheet throughout thickness during three-point bending process. Especially, a parametric study of DIC technique was conducted. The results show that the subset value and step size has a great impact on the strain distribution date. In order to obtain a lower iterations and confidence of the image, reasonable step size and subset value should be decided.

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Periodical:

Materials Science Forum (Volume 861)

Pages:

222-226

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.861.222

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Online since:

July 2016

Authors:

Li Jie Wang*, Brad Kinsey

Keywords:

Digital Image Correlation, Micro-Bending, Parametric Study, Strain Distribution

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References

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