A Comparison among Dry Laser Ablation and Some Different Water-Laser Co-Machining Processes of Single Crystal Silicon Carbide

Abstract:

Single crystal silicon carbide (SiC) is a new semiconductor material that has a great potential to be widely used. However, SiC is a kind of difficult-to-machine material due to its extreme hardness and brittleness. The present study investigated the machinability of single crystal SiC using dry laser and three different water-laser co-machining processes. The results indicate that using the hybrid laser-waterjet micro-machining to micro-groove single crystal SiC can derive the clean and straight edges and thermal damage-free grooves.

• Periodical: Materials Science Forum (Volume 861)
• Pages: 3-8
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.861.3
• Online since: July 2016
• Authors: Shao Chuan Feng, Chuan Zhen Huang*, Jun Wang, Hong Tao Zhu, Peng Yao, Liang Wang
• Keywords: Dry Laser Ablation, Hybrid Laser-Waterjet Micro-Machining, Low-Pressure Waterjet Assisted Laser Machining, Single Crystal Silicon Carbide, Under-Water Laser Machining

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