Mathematical Modeling of Mechanized Technologies Soldering

Article Preview

Abstract:

The possibility of compliance with the required technological soldering conditions and ensuring their reproducibility for wave soldering, laser soldering, convection soldering have been researched. Comparing the experimental data to the results of mathematical modeling allowed selectng optimal modes of the wave, convection and laser soldering of electronic devices. The conclusion about the prospects of the analytical dependencies to improve mechanical soldering of electronic devices for any purpose. When heating by convection or wave solder, the temperature along the depth of the solder joints is less than when the contact or laser soldering. It was found that the temperature of the solder joints with infrared and laser soldering can be estimated based on the heat equation for a semi-infinite plate with a given heat flow on the surface. Warming up of the printing unit and, consequently, the solder joints when soldering, convection can be described by equations of the regular mode.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

573-577

Citation:

Online since:

September 2016

Authors:

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2016 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] N.F. Lashko, S.V. Lashko, Metal soldering, Mechanical Engineering, Moscow, (1967).

Google Scholar

[2] A.I. Pehovich, V.M. Liquid, Calculations of the thermal regime of solids, Energy, Leningrad, (1976).

Google Scholar

[3] G. Korn, T. Korn, Handbook of mathematics, Trans. ed. IG Aramanovicha, Nauka, Moscow, (1974).

Google Scholar

[4] G. Manco, Soldering and brazing, Mechanical Engineering, Moscow, (1968).

Google Scholar

[5] V.N. Shtennikov, Problems minimize the time of contact and laser soldering, Nano and Microsystem Technology. 2 (2009) 18-20.

Google Scholar

[6] V.N. Shtennikov, Comparison of the conveyor and chamber furnaces for convection soldering electronic components, Assembly in mechanical engineering, instrument making. 7 (2010) 12-15.

Google Scholar

[7] V.N. Shtennikov, Improvement of international standards for contact soldering in electronics, Welding International. 27 (2013) 384-386.

DOI: 10.1080/09507116.2012.715923

Google Scholar

[8] V.N. Shtennikov, Analysis of the Possibilities of Providing High-Quality Mechanized Soldering, Journal of Engineering Physics and Thermophysics. 2 (2015) 447-451.

DOI: 10.1007/s10891-015-1209-3

Google Scholar

[9] V.N. Shtennikov, Development of the Regimes of Semiautomatic Contact Soldering, Translated from Inzhenerno-Fizicheskii Zhurnal. 1 (2015) 278-280.

Google Scholar

[10] V.N. Shtennikov, Thermophysical Characteristics of the Protective Coating of the Soldering Rod, Translated from Inzhenerno-Fizicheskii Zhurnal. 1 (2015) 145-147.

Google Scholar