Ultrasonic-Vibration-Assisted Micromachining of Sapphire

Hiroki Wakabayashi; Ryo Koike; Yasuhiro Kakinuma; Tojiro Aoyama; Hiroyuki Shimada; Seiji Hamada

doi:10.4028/www.scientific.net/MSF.874.247

Paper Titles

Modeling of Kerf Profile Generated in Multi-Layered Laminate Composites with Abrasive Waterjet
p.219

Drilling of Rod End Faces Using Micro-Cutting Tools
p.227

Critical Feed/Tooth Value Providing Finest Machined Roughness by Peripheral Cutting with Micro Endmills
p.232

Basic Study on Ductile-Mode Grinding of Optical Glass Lenses with Rubber Bonded Diamond Wheels
p.241

Ultrasonic-Vibration-Assisted Micromachining of Sapphire
p.247

Experimental Research on High Speed Grinding of Silicon Nitride Ceramic Spindle
p.253

Analysis of the Temperature Field of the Diamond Wheel Dressed Using Laser Assisted Ultrasonic-Vibration Combined Dressing Method
p.261

Development of a New Truing Device Based on Electro-Contact Discharge Machining for Metal Bond Grinding Wheels
p.268

Laser-Profiling of Metal-Bonded Diamond Grinding Wheels
p.272

HomeMaterials Science ForumMaterials Science Forum Vol. 874Ultrasonic-Vibration-Assisted Micromachining of...

Ultrasonic-Vibration-Assisted Micromachining of Sapphire

Abstract:

Sapphire is an attractive engineering material for the cover glass of smartphones and wristwatches because of its high hardness and resistance to corrosion, wear, and heat. However, the high rate of tool wear and brittle chippings around the holes are serious problems associated with drilling sapphire. To enhance the accuracy and efficiency of the drilling process on sapphire, this paper presents a novel tool-path strategy using helical milling along with various tool path patterns. Experimental results show that the proposed method successfully reduces brittle chippings around the holes.

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Periodical:

Materials Science Forum (Volume 874)

Pages:

247-252

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.874.247

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Online since:

October 2016

Authors:

Hiroki Wakabayashi*, Ryo Koike, Yasuhiro Kakinuma, Tojiro Aoyama, Hiroyuki Shimada, Seiji Hamada

Keywords:

Micromachining, Sapphire, Ultrasonic Vibration

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References

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