Polarization Study of Sn-0.7Cu Solder Alloy in 1M Hydrochloric Solution

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Corrosion properties of Sn-0.7Cu solder were investigated in 1 M HCl. The scanning rates used were 0.5, 1.0, 1.5 and 2.0 mVs-1 to study the aggressiveness level of HCl electrolyte in various environment. The morphological, elemental and structural of the samples were compared before and after the corrosion. Scan rate 1.0 mVs-1 was chosen as the most optimum scan rate during corrosion analysis. The morphological analysis observed two types of corrosion product which is compacted and loosely-compacted corrosion product after the samples was polarized in 1 M HCl.

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394-399

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March 2017

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© 2017 Trans Tech Publications Ltd. All Rights Reserved

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