Morphology of Intermetallic Compound and Interface Bonding State in Pure Al/Steel Clad Plates after 645°C/1h Diffusion Annealing

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The correlation between intermetallic compound (IMC) and interface bonding state of the pure Al/08Al steel clad plate after 645°C/1h diffusion annealing was studied using the SEM. The results indicated that after 645°C/1h diffusion annealing for the pure Al/08Al steel clad plate, the IMC grew continuously along the interface with the thickness of 2-6 μm, while, at some regions grew abnormally with the thickness up to 10-30 μm. Moreover, some intrinsic defects at the interface, such as voids in the abnormally grown IMC and micro cracks along the interface were observed. The voids were possibly caused by huge difference of Al and Fe in diffusion coefficient, which is known as Kirkendall effect. On the other hand, the micro cracks could be attributed to the thermal stress during the cooling process because of larger difference of thermal expansion rate between Al and Al-Fe IMC. The intrinsic defects at the interface of Al/Steel could supply a novel way to correlate the morphology of IMC and interface bonding strength.

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964-970

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June 2017

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© 2017 Trans Tech Publications Ltd. All Rights Reserved

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[1] Li Long, Nagai Kotobu, Yin Fuxing, Progress in cold roll bonding of metals[J], Science and Technology of Advanced Materials. 2008, 9(2): 1-11.

Google Scholar

[2] Manesh H Danesh, ShahabiH Sh, Effective parameters on bonding strength of roll bonded Al/Steel/Al multilayer strips[J], Journal of Alloys and Compounds. 2009, 476(1-2): 292-299.

DOI: 10.1016/j.jallcom.2008.08.081

Google Scholar

[3] Bay N, Coldwelding. Part 2: Process variants and application[J], Metal Construction. 1986, 19(8): 486-490.

Google Scholar

[4] Peng Zhi-hui, Technical Features and Developing Trend of Roll Cladding Aluminum Alloy Composite Materials for Heat Transfer Purposes[J], ShangHai Nonferrous Metals. 2009, 31(1): 35-40.

Google Scholar

[5] Yeong-Maw Hwang, Hung-Hsiou Hsu, Hung-Jen Lee, Analysis of sandwich sheet rolling by stream function method[J], International Journal of Mechanical Science. 37(3) (1995) 297.

DOI: 10.1016/0020-7403(95)93522-8

Google Scholar

[6] Madaah-Hosseini HR, Kokabi AH, Cold roll bonding of 5754-aluminum strips[J], Material Science and Engineering: A. 2002; 335: 186–90.

DOI: 10.1016/s0921-5093(01)01925-6

Google Scholar

[7] H. Danesh Manesh, A. Karimi Taheri, The effect of annealing treatment on mechanical properties of aluminum clad steel[J], Materials&Design. 2003, 24(8): 617-622.

DOI: 10.1016/s0261-3069(03)00135-3

Google Scholar

[8] H. Kawase, M. Makimoto, K. Takagi, Y. Ishida, T. Tanaka, Development of aluminum clad steel by roll bonding[J], Trans. ISIJ. 23 (1983)628.

DOI: 10.2355/isijinternational1966.23.628

Google Scholar

[9] H. Danesh Manesh, A. Karimi Taheri, Bond strength and formability of an aluminum-clad steel sheet[J], Journal of Alloys and Compounds. 361 (2003) 138–143.

DOI: 10.1016/s0925-8388(03)00392-x

Google Scholar

[10] M. Movahedi, A.H. Kokabi, S.M. Seyed Reihani, Investigation on the bond strength of Al-1100/St-12 roll bonded sheets, optimization and characterization [J], Materials and Design. 32 (2011) 3143–3149.

DOI: 10.1016/j.matdes.2011.02.057

Google Scholar

[11] Wang Qian, Leng Xue-song, Yang Tian-hao, Yan Jiu-chun, Effects of FeAl intermetallic compounds on interfacial bonding of clad materials[J], Transactions of Nonferrous Metals Society of China. 24(2014) 279-284.

DOI: 10.1016/s1003-6326(14)63058-2

Google Scholar

[12] D. Naoi, M. Kajihara, Growth behavior of Fe2Al5 during reactive diffusion between Fe and Al at solid-state temperatures[J], Materials Science and Engineering A. 459 (2007) 375-382.

DOI: 10.1016/j.msea.2007.01.099

Google Scholar

[13] V. G. M. Sivel, J. Van Den Brand, W. R. Wang, H. Mohdadi, F. D. Tichelaar, P. F. A. Alkemade, H. W. Zandbergen, Application of the dual-beam FIB/SEM to metals research[J], Journal of Microscopy. 214(2004) 237-245.

DOI: 10.1111/j.0022-2720.2004.01329.x

Google Scholar

[14] H. Springer , A. Kostka , E.J. Payton , D. Raabe , A. Kaysser-Pyzalla, G. Eggeler, On the formation and growth of intermetallic phases during interdiffusion between low-carbon steel and aluminum alloys[J], Acta Materialia. 59 (2011) 1586–1600.

DOI: 10.1016/j.actamat.2010.11.023

Google Scholar

[15] J. H. Huang, Diffusion in metal and alloy [M], Metallurgical Industry Press, Beijing, (1996).

Google Scholar

[16] Yong Du, Y. A. Chang, Diffusion coefficients of some solutes in fcc and liquid Al: critical evaluation and correlation[J], Materials Science and Engineering A. 363 (2003) 140–151.

DOI: 10.1016/s0921-5093(03)00624-5

Google Scholar

[17] Vikas Jindal, V.C. Srivastava, Growth of intermetallic layer at roll bonded IF-steel/ aluminum interface[J], Journal of materials processing technology. 195(2008): 88–93.

DOI: 10.1016/j.jmatprotec.2007.04.118

Google Scholar

[18] Wang Ping, Xie Peipei, Restraining mechanism of compound of steel-aluminum rolling bonding composite board[J], The Chinese Journal of Nonferrous Metals. (20)2010: 284-288.

Google Scholar

[19] Zhou Dejing, Yin Lin, Zhang Xinming, Tang Jianguo, Liu Xingxing, Growth kinetics of intermetallic compounds at aluminum/stainless steel interface bonded by rolling[J], The Chinese Journal of Nonferrous Metals. 22(2012): 2461-2468.

Google Scholar

[20] Liu Bangjin, Hot Dip Aluminized Steel [M], BeiJing: Metallurgical Industry Press, (1995).

Google Scholar

[21] F. C. Nix, D. MacNair, The Thermal Expansion of Pure Metals: Copper, Gold, Aluminum, Nickel, and Iron[J], Physical Review. (60)1941, 597-605.

DOI: 10.1103/physrev.60.597

Google Scholar