Effects of Antimony and Indium Addition on Wettability and Interfacial Reaction of Sn-3.0Ag-0.5Cu Lead Free Solder on Copper Substrate

Suchart Chantaramanee; Worawit Sriwittayakul; Phairote Sungkhaphaitoon

doi:10.4028/www.scientific.net/MSF.928.188

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HomeMaterials Science ForumMaterials Science Forum Vol. 928Effects of Antimony and Indium Addition on...

Effects of Antimony and Indium Addition on Wettability and Interfacial Reaction of Sn-3.0Ag-0.5Cu Lead Free Solder on Copper Substrate

Abstract:

The effects of antimony and indium addition on wettability and interfacial reaction of Sn-3.0Ag-0.5Cu lead free solder on copper substrate were investigated. The experimental results showed the melting point of solder alloy containing 0.5 wt.% In and 0.5 wt.% Sb were slightly increased about 3.66°C. The pasty range of solder alloys were increased about 6°C while the undercooling of solder alloys were decreased. The microstructures of solder alloy were contained of In and Sb consists of Ag₃Sn, Cu₆(Sn,In)₅, SnIn, Ag₃(Sn,In) and SnSb intermetallic compounds (IMCs) dispersed on Sn-rich phase. The wettability of solder alloys were improved by increasing soldering times. In addition, the thickness of intermetallic compounds (Cu₆Sn₅) were obviously increased with increasing soldering times.

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Periodical:

Materials Science Forum (Volume 928)

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188-193

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.928.188

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Online since:

August 2018

Authors:

Suchart Chantaramanee*, Worawit Sriwittayakul, Phairote Sungkhaphaitoon

Keywords:

Intermetallic Compounds (IMCs), Lead-Free Solder Alloys, SAC305, Wettability

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References

[1] D.R. Frear: J. Mater Sci: Mater Electron Vol. 18 (2007), p.319.

Google Scholar

[2] S. Cheng, C.M. Huang and M. Pecht: Microelectronics Reliability Vol 75 (2017), p.77.

Google Scholar

[3] A.A. El-Daly, A.E. Hammad, A. Fawzy and D.A. Nasrallh: Mater. Design Vol. 43 (2013), p.40.

Google Scholar

[4] M.H. Mahdavifard, M.F.M. Sabi, D.A. Shnawah, L.A. Badruddin and S. Rozali: Microelectronics Reliability Vol. 55 (2015), p.1886.

DOI: 10.1016/j.microrel.2015.06.134

Google Scholar

[5] C.M. Chuang, and K.L. Lin: J. Electron. Mater Vol. 32 (2003), p.1426.

Google Scholar

[6] B.L. Chen and G.Y. Li: Thin Solid Films Vol. 462 (2004), p.395.

Google Scholar

[7] L.F. Li, Y.K. Cheng, C.L. Xu, E.Z. Wang, Z.H. Zhang and H. Wang: Mater. Design Vol. 64 (2014), p.15.

Google Scholar

[8] S. Chantaramanee, P. Sungkhaphaitoon and T. Plookphol: Solid State Phenomena Vol. 266 (2017), p.196.

Google Scholar

[9] S.M.L. Nai, J.Wei and M. Gupta: Mat. Sci. Eng. A Vol. 423 (2006), p.166.

Google Scholar

[10] Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan and J.Wei: J. Electron. Mater Vol. 41 (2012), p.2478.

Google Scholar

[11] B. Kim, C.W. Lee, D. Lee and N. Kang: J. Alloy Compd Vol. 592 (2014), p.207.

Google Scholar

[12] K. Kanlayasiri, M. Mongkolwongrojn and T. Ariga: J. Alloy Compd Vol. 485 (2009), p.225.

Google Scholar

[13] J. Zhou, Y. Sun and F. Xue: J. Alloy Compd. Vol. 397 (2005), p.260.

Google Scholar

[14] H.T. Lee, C.Y. Lee, F.F. Lee, Chen and Y.H. Lee: J. Electron. MaterVol. 38 (2009), p.211.

Google Scholar

[15] D.Q. Yu, J. Zhao and L.Wang: J. Alloy Compd Vol. 376 (2004), p.170.

Google Scholar

[16] L. Zang, Z. Yuan, H. Zhao and X. Zhang: Materials Letters Vol. 63 (2009), p. (2067).

Google Scholar

[17] N. Zhao, M.L. Huang, Y. Zhong, H.T. Ma and X.M. Pan: J. Electron. Mater Vol. 26 (2015), p.345.

Google Scholar