Behavior of Polypyrrole Film Chemically Polymerized with Lauric Acid on Copper Surface

Abstract:

Pyrrole was successfully polymerized on copper surface in ethanol solution using hydrogen peroxide as catalyst to generate an adherent and homogeneous polypyrrole (PPy) coating. The PPy was formed of clusters composed of small spherical grains. The layer has remained stable when immersed in 0.1mol L^-1 NaCl for 7 days, which indicated that the copper-PPy arrangement is stable in corrosive environment. The polarisation curves showed that the PPy layer can promote a positive displacement in the corrosion potential compared to the value of the uncoated copper. It also was observed that the corrosion current density decreases sharply in the presence of the lauric acid as dopant. These results indicate that PPy-lauric acid can act as a protective layer on copper and improve the overall corrosion performance.

• Periodical: Materials Science Forum (Volume 930)
• Pages: 434-439
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.930.434
• Online since: September 2018
• Authors: Bárbara Ramos Ferreira*, A.S. Liu, Liu Yao Cho
• Keywords: Chemical Deposition, Copper, Lauric Acid, Polypyrrole

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