Decoration of Al Implantation Profiles in 4H-SiC by Bevel Grinding and Dry Oxidation

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The possibility to analyze micrometer scaled 2D implantation profiles is essential for improving SiC power devices. Due to the fact that the oxidation rate depends on the doping concentration a rather simple method was developed in order to decorate highly doped (aluminum) implantation profiles. For this purpose, different samples were grinded with a shallow bevel angle and subsequently oxidized. It could be shown that this method allows analyzing the implantation depth of different box-shape implanted samples. Furthermore the ability to distinguish micrometer scaled 2D profiles for a state-of-the-art SiC power device could be shown.

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441-444

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July 2019

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© 2019 Trans Tech Publications Ltd. All Rights Reserved

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