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HomeMaterials Science ForumMaterials Science Forum Vol. 985Effect of Electroless Ni-P Plating on the Bonding...

Effect of Electroless Ni-P Plating on the Bonding Strength of PbTe Thermoelectric Module Using Silver Alloy-Based Brazing

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Abstract:

This study investigates a brazing method for manufacturing PbTe thermoelectric modules using a Ag-based filler metal with a melting point of about 650 °C. To improve the bonding strength between the Ag-based brazing layer and the PbTe thermoelectric module, an electroless Ni-P plating layer is formed on the surface of the thermoelectric module as a diffusion barrier layer. The bonding strength of the PbTe thermoelectric module manufactured by the electroless Ni-P plating and Ag-based brazing has a high value of approximately 8.3 MPa. No defects such as pores or cracks were observed at the bonding interface between the thermoelectric element and the brazing layer. Furthermore, because of the high bonding strength of the manufactured thermoelectric module, fractures occur inside the thermoelectric element rather than at the bonding interface. Accordingly, the electroless Ni-P plating and Ag-based brazing method proposed in this study is found to be effective in manufacturing PbTe-based thermoelectric modules with high bonding strength.

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Periodical:

Materials Science Forum (Volume 985)

Pages:

16-22

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.985.16

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Online since:

April 2020

Authors:

Sung Hwa Bae, Joon Young Choi, Injoon Son*

Keywords:

Bonding Strength, Brazing, Pb-Te, Thermoelectric Module

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© 2020 Trans Tech Publications Ltd. All Rights Reserved

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