Formation and Characteristics of the Low Dielectric Carbon Doped Silicon Oxide Thin Film Deposited by MTMS/O2 – ICPCVD
Carbon doped silicon oxide (SiOC(-H)) films with low dielectric constant were deposited on a p-type Si(100) substrate using inductively coupled plasma chemical vapor deposition with a methyltrimethoxysilane (MTMS : CH3Si(OCH3)3) precursor and oxygen gases. The dielectric constant of the SiOC(-H) composite film depends on the relative carbon concentration and the content of the ring link mode in SiOC(-H) bonding structure. The elastic modulus and the dielectric constant decreased by the annealing process. The lowest dielectric constant of an annealed film at 400 °C was about 2.25, which was deposited with [MTMS/(MTMS+O2)]×100 flow ratio of 100%.
T. Vilaithong, D. Boonyawan and C. Thongbai
C. S. Yang et al., "Formation and Characteristics of the Low Dielectric Carbon Doped Silicon Oxide Thin Film Deposited by MTMS/O2 – ICPCVD", Solid State Phenomena, Vol. 107, pp. 103-106, 2005