Adhesion Properties of Copper/Polyimide Film Modified by Reactive Ion Etching(RIE)

Abstract:

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Surface modification of polyimide(PI) films was treated with oxygen RIE by varying ion doses from 1x1016 to 1x1018 ions/cm2 at an ion beam energy of 250 eV. Following the modification of PI surface, metal films consisting of NiCr/Cu and Cu were deposited on modified PI films by D.C. magnetron sputtering and electroplating, respectively. The surface modified PI film was characterized by XPS, AFM, SEM and contact angle measurement, respectively. The water contact angle of PI film decreased significantly from 64° to 4.4° with an increase of ion dose, indicating that the surface energy of PI film increased. The XPS spectrum showed that functional group, particularly C-O bonding, on modified PI surface was significantly increased by interaction between scissored unstable chains and reactive ions. The modified PI film surfaces by oxygen RIE showed significant improvement in adhesion to a overcoated metal film of NiCr/Cu.

Info:

Periodical:

Solid State Phenomena (Volumes 124-126)

Edited by:

Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park

Pages:

1593-1596

DOI:

10.4028/www.scientific.net/SSP.124-126.1593

Citation:

W.J. Lee et al., "Adhesion Properties of Copper/Polyimide Film Modified by Reactive Ion Etching(RIE)", Solid State Phenomena, Vols. 124-126, pp. 1593-1596, 2007

Online since:

June 2007

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Price:

$35.00

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