Transmission Electron Microscopy Observations on Cu-Mg Alloy Systems

Ken Ichi Nishikawa; Satoshi Semboshi; Toyohiko J. Konno

doi:10.4028/www.scientific.net/SSP.127.103

Paper Titles

Reaction Diffusion in Diffusion Couples Ni-Al SolidSolution/Intermetallic NiAl and Ni/Intermetallic NiAl
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Effects of a Small Amount of Ta on Diffusion Behavior of Carbon in Molybdenum
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Characterization of (α+β)/β Transformation in a TC11 Titanium Alloy
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Hydrogen Permeation in V-Nb Alloys
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Transmission Electron Microscopy Observations on Cu-Mg Alloy Systems
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Oxidation Behavior of SiC/TiAl Composite Material
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Reaction of Sn to Nanocrystalline Surface Layer of Cu by Near Surface Severe Plastic Deformation
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Interfacial Residual Stresses in Semiconductor Devices Measured on the Nano-Scale by Cathodoluminescence Piezospectroscopy
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Direct Synthesis of Isolated L1₀-FePtCu Nanoparticles by RF-Magnetron Sputtering
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Transmission Electron Microscopy Observations on Cu-Mg Alloy Systems

Abstract:

Environmentally friendly Cu-based alloys with high strength and low electrical resistivity have been much sought in order to replace deleterious Cu-Be alloys for electrical applications. As one of the candidate systems, we have examined age-hardening behaviors of Cu-Mg alloys by using transmission electron microscopy (TEM). Cu-2.26wt.%Mg alloys were solution-treated and annealed at 723K, and their structural changes have been investigated. The Vickers hardness measurements showed that they aged-harden gradually. Our TEM observations showed that annealing for 6h brings about precipitation of numerous needle-like particles of 10 nm in length. The diffraction studies indicated these precipitates consist of the Cu2Mg phase with {111}Cu habit planes. When annealed for 96h, these precipitates become semi-coherent, which was manifested by moiré fringes; while maintaining the orientation relationship of (111)Cu//(111)Cu2Mg, [110]Cu//[110]Cu2Mg.