Reaction of Sn to Nanocrystalline Surface Layer of Cu by Near Surface Severe Plastic Deformation

Yoritoshi Minamino; Yuichiro Koizumi; Nobuhiro Tsuji; Y. Nakamizo; Toshiya Shibayanagi; Masaaki Naka

doi:10.4028/www.scientific.net/SSP.127.115

Paper Titles

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Oxidation Behavior of SiC/TiAl Composite Material
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Reaction of Sn to Nanocrystalline Surface Layer of Cu by Near Surface Severe Plastic Deformation
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Direct Synthesis of Isolated L1₀-FePtCu Nanoparticles by RF-Magnetron Sputtering
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Reaction of Sn to Nanocrystalline Surface Layer of Cu by Near Surface Severe Plastic Deformation

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Solid State Phenomena (Volume 127)

Pages:

115-120

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.127.115

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Online since:

September 2007

Authors:

Yoritoshi Minamino, Yuichiro Koizumi, Nobuhiro Tsuji, Y. Nakamizo, Toshiya Shibayanagi, Masaaki Naka

Keywords:

Diffusion, Electroplated Tin, Intermetallic Compound (IMC), Layer Growth, Near Surface Severe Plastic Deformation, Near Surface Ultrafine Grains, OFHC-Cu, Reaction

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References

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