Bonding Strength of W-Cu Joint by PECS Method

Abstract:

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To make the tungsten and copper joint, several methods has been tried using the diffusion bonding system. When the thin plating Ni layer was used as the interlayer on tungsten surface, it bonded with copper under low bonding temperature and short holding duration by the pulse electric current sintering (PECS) machine. The effects of bonding temperature, bonding duration time, bonding pressure and the difference of specimen shape on the bonding strength were investigated. The tensile strength of joints depended on these factors. Highest strength attained to the copper tensile strength.

Info:

Periodical:

Solid State Phenomena (Volume 127)

Edited by:

Masaaki Naka

Pages:

271-276

DOI:

10.4028/www.scientific.net/SSP.127.271

Citation:

Y. Fukuzawa et al., "Bonding Strength of W-Cu Joint by PECS Method ", Solid State Phenomena, Vol. 127, pp. 271-276, 2007

Online since:

September 2007

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Price:

$35.00

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