Bonding Strength of W-Cu Joint by PECS Method

Yasushi Fukuzawa; Shigeru Nagasawa; Shigehiko Takaoka

doi:10.4028/www.scientific.net/SSP.127.271

Paper Titles

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Numerical Simulation of the Stress Field of Thick 7B04 Aluminum Alloy Board during Continuous Manufacture Procedure
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Microstructure and Properties of Brazing Joint between YG8 Cemented Carbide and A3 Steel
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Bonding Strength of W-Cu Joint by PECS Method
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Evaluation of Compound Layer Formed by Impact Welding Using Phase Transformation Technique
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HomeSolid State PhenomenaSolid State Phenomena Vol. 127Bonding Strength of W-Cu Joint by PECS Method

Bonding Strength of W-Cu Joint by PECS Method

Abstract:

To make the tungsten and copper joint, several methods has been tried using the diffusion bonding system. When the thin plating Ni layer was used as the interlayer on tungsten surface, it bonded with copper under low bonding temperature and short holding duration by the pulse electric current sintering (PECS) machine. The effects of bonding temperature, bonding duration time, bonding pressure and the difference of specimen shape on the bonding strength were investigated. The tensile strength of joints depended on these factors. Highest strength attained to the copper tensile strength.

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Periodical:

Solid State Phenomena (Volume 127)

Pages:

271-276

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.127.271

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Online since:

September 2007

Authors:

Yasushi Fukuzawa, Shigeru Nagasawa, Shigehiko Takaoka

Keywords:

Bonding Strength, Interlayer, Joining, Pulsed Electric Current Sintering (PECS)

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References

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