Room Temperature Micro-Bonding of Fine Wires to Foils

Yasuo Takahashi; Masakatsu Maeda; Takehisa Doki; Souta Matsusaka

doi:10.4028/www.scientific.net/SSP.127.277

Paper Titles

Preparation and Characterization of Hard (Ti,B)N Films by Ion Mixing and Vapor Deposition
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Numerical Simulation of the Stress Field of Thick 7B04 Aluminum Alloy Board during Continuous Manufacture Procedure
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Microstructure and Properties of Brazing Joint between YG8 Cemented Carbide and A3 Steel
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Bonding Strength of W-Cu Joint by PECS Method
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Room Temperature Micro-Bonding of Fine Wires to Foils
p.277

Evaluation of Compound Layer Formed by Impact Welding Using Phase Transformation Technique
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Pulsed Electric Current Bonding of Tungsten to Copper with Intermediate Layer
p.289

Laser-Arc Hybrid Welding
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Theoretical Approaches to Erosion and Wetting Phenomena during Laser Brazing Process
p.301

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Room Temperature Micro-Bonding of Fine Wires to Foils

Abstract:

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