Numerical Simulation of the Stress Field of Thick 7B04 Aluminum Alloy Board during Continuous Manufacture Procedure

Abstract:

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Numerical simulation method is employed in the article to analyze the stress field of thick 7B04 aluminum alloy board during manufacturing procedure of solution treatment, calendaring and stretching. The simulation results show that the surface of the board endures compressive stress while the core segment endures tensile stress, and the distribution of the stress is very inhomogeneous. The calendaring procedure helps to decrease the stress and redistribute the stress uniformly, but it also leads to stress concentration at the two ends of the board, which engenders bad influence on the subsequent processing. The board deforms plastically when being stretched, thus the stress decreases greatly and is redistributed uniformly.

Info:

Periodical:

Solid State Phenomena (Volume 127)

Edited by:

Masaaki Naka

Pages:

259-264

DOI:

10.4028/www.scientific.net/SSP.127.259

Citation:

H. Y. Fang and C. I. Fan, "Numerical Simulation of the Stress Field of Thick 7B04 Aluminum Alloy Board during Continuous Manufacture Procedure ", Solid State Phenomena, Vol. 127, pp. 259-264, 2007

Online since:

September 2007

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Price:

$35.00

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