Refinement of the Cu Structure by Oscillatory Compression Test

Kinga Rodak; Tomasz Goryczka

doi:10.4028/www.scientific.net/SSP.130.111

Paper Titles

X-Ray Analysis of the Cd_0.5Ge_0.5Cr₂Se₄ and CdCr_1.9Ge_0.075Se₄ Compounds
p.93

Structure Studies of Electrodeposited Ni-Mo Alloys with Polymers after Annealing
p.97

Structural Refinement and Homogeneity Range of Sm₆Al₃Si
p.101

Crytalline Precipitates in Silver Ion Conducting Materials
p.107

Refinement of the Cu Structure by Oscillatory Compression Test
p.111

Influence of the Ga Alloying on the Properties of NiAl Based Alloys
p.117

Preparation by Twin Roll Casting and Characterization of TiNi Shape Memory Alloys Strips
p.121

Effect of L2₁ Ordering on the Martensitic and Intermartensitic Transformations in a Ni-Mn-Ga Shape Memory Alloy
p.127

The Effect of the Annealing Parameters on the Structure and Characteristic Temperatures of the Nonstoichiometric Ni₂MnGa Alloys
p.135

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Refinement of the Cu Structure by Oscillatory Compression Test

Abstract:

Polycrystalline Cu has been deformed at room temperature by oscillatory compression method to true reduction εh = 0.6 and 1. Microstructure by using transmission electron microscopy (TEM) and texture evolution after deformations was investigated. Oscillatory compressed microareas contains two distinctive regions: fine grains inside banded microstructure with large misorientation and surrounding matrix with submicrometer subgrains with a fraction of both low and high angle boundaries. Moreover nucleation of new grains under recrystallization takes place at the local-regions. The study of the crystal orientation distribution during applied deformation showed that the pole figure registered for the sample after compression shows ring of pole density, which concentrates around projection of <011>. Oscillatory compression causes formation of two axial texture components: <001> and <011>.