Grain Boundaries in Multicrystalline Si

Abstract:

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We report the electrical, structural and mechanical properties of grain boundaries (GBs) in multicrystalline Si (mc-Si) based on electron-beam-induced current (EBIC), transmission electron microscope (TEM), and scanning infrared polariscope (SIRP) characterizations. The recombination activities of GBs are clearly classified with respect to GB character and Fe contamination level. The decoration of Fe impurity at boundary has been approved by annular dark field (ADF) imaging in TEM. Finally, the distribution of residual strain around GBs, and the correlations between strain and electrical properties are discussed.

Info:

Periodical:

Solid State Phenomena (Volumes 156-158)

Edited by:

M. Kittler and H. Richter

Pages:

19-26

DOI:

10.4028/www.scientific.net/SSP.156-158.19

Citation:

J. Chen et al., "Grain Boundaries in Multicrystalline Si", Solid State Phenomena, Vols. 156-158, pp. 19-26, 2010

Online since:

October 2009

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Price:

$35.00

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