Reactive Diffusion between Ti and Cu-9.3Sn-0.3Ti Alloy at Solid-State Temperatures

Abstract:

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The reactive diffusion between Ti and a bronze was experimentally examined using sandwich diffusion couples consisting of Ti and a Cu-9.3Sn-0.3Ti alloy. The diffusion couples were isothermally annealed at temperatures of T = 923-1023 K. During annealing, CuTi, (Cu, Sn)4Ti3 and (Sn, Cu)5Ti6 compounds are formed as layers at the interface in the diffusion couple. The overall growth of the compound layers is controlled by volume diffusion at T = 1023 K but by boundary and volume diffusion at T = 923-973 K. Hence, the interface reaction is not the bottleneck for the growth of the compound layers under the present experimental conditions.

Info:

Periodical:

Solid State Phenomena (Volumes 172-174)

Edited by:

Yves Bréchet, Emmanuel Clouet, Alexis Deschamps, Alphonse Finel and Frédéric Soisson

Pages:

470-474

DOI:

10.4028/www.scientific.net/SSP.172-174.470

Citation:

M. Kajihara and S. Nakamura, "Reactive Diffusion between Ti and Cu-9.3Sn-0.3Ti Alloy at Solid-State Temperatures", Solid State Phenomena, Vols. 172-174, pp. 470-474, 2011

Online since:

June 2011

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Price:

$35.00

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