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HomeSolid State PhenomenaSolid State Phenomena Vols. 172-174Reactive Diffusion between Ti and Cu-9.3Sn-0.3Ti...

Reactive Diffusion between Ti and Cu-9.3Sn-0.3Ti Alloy at Solid-State Temperatures

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Abstract:

The reactive diffusion between Ti and a bronze was experimentally examined using sandwich diffusion couples consisting of Ti and a Cu-9.3Sn-0.3Ti alloy. The diffusion couples were isothermally annealed at temperatures of T = 923-1023 K. During annealing, CuTi, (Cu, Sn)₄Ti₃ and (Sn, Cu)₅Ti₆ compounds are formed as layers at the interface in the diffusion couple. The overall growth of the compound layers is controlled by volume diffusion at T = 1023 K but by boundary and volume diffusion at T = 923-973 K. Hence, the interface reaction is not the bottleneck for the growth of the compound layers under the present experimental conditions.

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Periodical:

Solid State Phenomena (Volumes 172-174)

Pages:

470-474

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.172-174.470

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Online since:

June 2011

Authors:

Masanori Kajihara, Shingo Nakamura

Keywords:

Interface Reaction, Intermetallic, Rate-Controlling, Reactive Diffusion, Superconductor

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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