The Study of Vibration Effects on Precision Grinding Surface Quality

Guo Bi; Yin Biao Guo

doi:10.4028/www.scientific.net/SSP.175.97

Paper Titles

Research on the Mechanical Properties of CaF₂ Crystal for Ultra-Precision Machining
p.77

Raman Analysis of the Silicon Wafer Scratched by Single Point Diamond
p.82

Material Removal Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern
p.87

The Effects of the Geometric Parameters of Segmented Sawblades on the Fluctuated Temperatures in Sawing
p.93

The Study of Vibration Effects on Precision Grinding Surface Quality
p.97

Analysis of Effecting Factors on Surface Finish of Fused Silica Glass Grinding with Inclined Ball-Headed Diamond Wheel
p.102

Experimental Study on Damage Mechanism of Nano-Ceramic Surface/Subsurface under Ultrasonic Vibration Aided Grinding
p.107

Study on Subsurface Damage after Fixed-Abrasive Lapping with Different Particle Size
p.112

A Research on the SiCp Reinforcing Cu-Base Composite Material's Cutting Performance
p.116

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The Study of Vibration Effects on Precision Grinding Surface Quality

Abstract:

The paper was dedicated to surface grinding, in which axisymmetric surface and non-axisymmetric surface are presented. Machined traces deviate from the vibration waveform because of the geometrical interference between the wheel and the workpiece. Simulation and experimental results indicate that the spectrum of the machined trace is competent for the detection of the vibration source. The deviation of the machined trace from the vibration waveform is greatly influenced by operating parameters, and reasonable choice of them is beneficial to surface smoothness.