Material Removal Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern

Abstract:

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In order to make the material removal distribution on polishing silicon surface more non-uniform during the chemical mechanical polishing (CMP), a kind of the bionic polishing pad with phyllotactic pattern has been designed based on phyllotaxis theory, and by polishing experiment, the effects of the phyllotaxis parameters on material removal distributions on silicon wafer surfaces are investigated. The research results show that the material removal distribution of polishing silicon surface more uniform and the edge rounding of polishing wafer can be decreased when the phyllotaxis parameters of the polishing pad are reasonably selected.

Info:

Periodical:

Solid State Phenomena (Volume 175)

Edited by:

Xipeng Xu

Pages:

87-92

DOI:

10.4028/www.scientific.net/SSP.175.87

Citation:

Y. S. Lu et al., "Material Removal Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern", Solid State Phenomena, Vol. 175, pp. 87-92, 2011

Online since:

June 2011

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Price:

$35.00

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