Material Removal Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern

Yu Shan Lu; Jun Wang; Nan Li; Tian Zhang; Min Duan; Xue Ling Xing

doi:10.4028/www.scientific.net/SSP.175.87

Paper Titles

Analysis of Energy Consumption Efficiency in Diamond Circular Sawing
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Analysis of Grit Cut Depth in Fixed-Abrasive Diamond Wire Saw Slicing Single Crystal Silicon
p.72

Research on the Mechanical Properties of CaF₂ Crystal for Ultra-Precision Machining
p.77

Raman Analysis of the Silicon Wafer Scratched by Single Point Diamond
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Material Removal Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern
p.87

The Effects of the Geometric Parameters of Segmented Sawblades on the Fluctuated Temperatures in Sawing
p.93

The Study of Vibration Effects on Precision Grinding Surface Quality
p.97

Analysis of Effecting Factors on Surface Finish of Fused Silica Glass Grinding with Inclined Ball-Headed Diamond Wheel
p.102

Experimental Study on Damage Mechanism of Nano-Ceramic Surface/Subsurface under Ultrasonic Vibration Aided Grinding
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HomeSolid State PhenomenaSolid State Phenomena Vol. 175Material Removal Distribution of Chemical...

Material Removal Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern

Abstract:

In order to make the material removal distribution on polishing silicon surface more non-uniform during the chemical mechanical polishing (CMP), a kind of the bionic polishing pad with phyllotactic pattern has been designed based on phyllotaxis theory, and by polishing experiment, the effects of the phyllotaxis parameters on material removal distributions on silicon wafer surfaces are investigated. The research results show that the material removal distribution of polishing silicon surface more uniform and the edge rounding of polishing wafer can be decreased when the phyllotaxis parameters of the polishing pad are reasonably selected.

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Periodical:

Solid State Phenomena (Volume 175)

Pages:

87-92

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.175.87

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Online since:

June 2011

Authors:

Yu Shan Lu, Jun Wang, Nan Li, Tian Zhang, Min Duan, Xue Ling Xing

Keywords:

Bionic Polishing Pad, Chemical Mechanical Polishing (CMP), Material Removal Rate (MRR), Phyllotaxis, Silicon Wafer

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