Analysis of Grit Cut Depth in Fixed-Abrasive Diamond Wire Saw Slicing Single Crystal Silicon

Yu Fei Gao; Pei Qi Ge

doi:10.4028/www.scientific.net/SSP.175.72

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HomeSolid State PhenomenaSolid State Phenomena Vol. 175Analysis of Grit Cut Depth in Fixed-Abrasive...

Analysis of Grit Cut Depth in Fixed-Abrasive Diamond Wire Saw Slicing Single Crystal Silicon

Abstract:

A mathematical model to calculate the grit average cut depth in wire sawing single crystal silicon was founded. So the grit average cut depths were calculated theoretically by choosing different process parameters, and influences of process parameters on grit cut depths of slicing silicon crystal were analyzed. Analysis results indicate that the grit average cut depth relates to the silicon mechanical properties, grit shape and size, wire speed and ingot feed speed, etc. And there is a monotone increasing non-linear correlation between grit average cut depth and the ratio i value of ingot feed speed and wire speed, when the i value is lower, the average grit cut depth is lower.

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Periodical:

Solid State Phenomena (Volume 175)

Pages:

72-76

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.175.72

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Online since:

June 2011

Authors:

Yu Fei Gao, Pei Qi Ge

Keywords:

Grit Cut Depth, Process Parameter, Single Crystal Silicon, Wire Saw

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References

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