Microstructure, Chemistry and Mechanical Properties of the Ni/AgBiCuSn/Ni Interconnections

Abstract:

The paper presents results of electron microscopy studies on the microstructure, chemical composition and mechanical properties of the Ni/AgBiCuSn/Ni interconnections obtained due to the conventional soldering. The scanning (SEM) and (TEM) transmission electron microscopy combined with an energy dispersive X-ray spectroscopy allowed to reveal the presence of two intermetallic phases (Ag3Sn and Cu6Sn5) in the whole interconnection area for all the applied solders and soldering times. In the vicinity of Ni substrate both phases were modified with Ni (2-4.5 %at.). Some of Ag3Sn precipitates took the elongated shape and they were located across whole interconnection width. The SEM examination after shear test showed that the joints ruptured in a ductile manner, as manifested by the dimples present on the fracture surfaces. The dimples prove also that the plastic deformation occurred along the loading direction.

• Periodical: Solid State Phenomena (Volume 186)
• Pages: 239-242
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.186.239
• Online since: March 2012
• Authors: Anna Sypień, Lidia Lityńska-Dobrzyńska, Anna Wierzbicka-Miernik, Pawel Zieba
• Keywords: EDX, High-Temperature Soldering, SEM, TEM

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