Fabrication and Test of High-Temperature Ceramic Transformer

Conor Slater; Thomas Maeder; Peter Ryser

doi:10.4028/www.scientific.net/SSP.216.233

Paper Titles

The Effect of Laser Shock Processing on Corrosion Resistance of Stainless Steel AISI 316L
p.210

The Influence of the Sintering Temperature on the Wear Testing for Some Steels Samples Obtained by Powder Metallurgy
p.216

Wear Behaviour of New CoCrMoTi Dental Alloys
p.222

Wear Particle Analysis, the Result of Tribological Phenomena of Biomaterials Couplings-Ultra Hight Molecular Weight Polyethylene and Magnesium Aluminosilicate Ceramic
p.226

Fabrication and Test of High-Temperature Ceramic Transformer
p.233

Metallic Biomaterials Processing Technologies in Order to Obtain a New Design for a Hip Prosthesis Femoral Component
p.239

Nanocrystalline/Nanosized Mixed Nickel-Manganese Ferrites Obtained by Mechanical Milling
p.243

Open Cell Al-Si Foams by a Sintering and Dissolution Process
p.249

Optimizing the Parameters of Reactive Sintering for In Situ Fabrication of Al-Al₂O₃ Composites
p.255

HomeSolid State PhenomenaSolid State Phenomena Vol. 216Fabrication and Test of High-Temperature Ceramic...

Fabrication and Test of High-Temperature Ceramic Transformer

Abstract:

This work describes the fabrication and test of a high temperature (+200°C) capable high frequency transformer. It was manufactured using Low Temperature Co-fired Ceramic (LTCC) technology, which allowed the complex multilayer structure of ceramic and metal windings to be formed. However, the selected LTCC composition is a free sintering ceramic and there is an interaction between the metal conductor and the ceramic substrate during lamination and firing that can lead to significant deformation, presenting a significant engineering challenge. Here the fabrication process for the LTCC is described (screen printing, collation, lamination and firing) for a number of iterations of the transformer design, each of which was analysed for deformation and subjected to electrical tests. In addition a silicone adhesive for assembling the LTCC with the transformer was analysed for high-temperature performance. A test vehicle was assembled and it was subjected to 1000 hours at 210°C. Shear tests were performed at intervals to quantify the loss in bond strength over time. After a good solution for manufacture was found, a batch of transformers was produced, characterized and tested to demonstrate a high reproducibility and manufacturing yield.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Solid State Phenomena (Volume 216)

Pages:

233-238

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.216.233

Citation:

Cite this paper

Online since:

August 2014

Authors:

Conor Slater*, Thomas Maeder, Peter Ryser

Keywords:

Electronics, High-Temperature, LTCC, Transformer

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] C. Slater and P. Vassy. LTCC: A packaging technology suitable for high density integration and high temperature applications. In Proceedings of the 6th European Aeronautics Days (2011), 345-352.

Google Scholar

[2] B. McPherson, J. Horberger, J. Bourne, A. Lostetter, R. Schupbach, R. Shaw, B. Reese, B. Rowden, A. Mantooth, S. Ang, J. Balda, K. Okumura, and T. Otsuka. Packaging of high temperature 50 kW SiC motor drive modules for hybrid-electric vehicles. Advancing Microelectronics (2010).

DOI: 10.4071/hitec-rschupbach-wp23

Google Scholar

[3] D. L. Crook. Evolution of VLSI reliability engineering. Reliability Physics (1990), 2–11.

Google Scholar