Focus Spot Reduction by Brush Scrubber Cleaning

Antoine Pacco; Els Kesters; Ihsan Simms; Kathleen Nafus; Jelle Vandereyken; Hiroki Yonekawa

doi:10.4028/www.scientific.net/SSP.219.276

Paper Titles

Correlation of Cleaning Conditions and Wafer Out-Gassing
p.260

Quantitative Analysis of Transition Metals Penetrating Silicon Substrate through SiN Film by Dopant Ion Implantation and Annealing
p.265

Collection Efficiency of Noble Metallic Contaminants on Si Wafers with HF-Aqua Regia Mixtures for VPD-DC ICPMS Analysis
p.268

Backside and Bevel Contamination Removal
p.272

Focus Spot Reduction by Brush Scrubber Cleaning
p.276

Upside-Down Residual Sessile Droplet: Watermarks on Wafers Backside
p.280

Nuclear Magnetic Resonance Spectroscopy of Trace Organic Impurities Extracted from a Corrosion Inhibitor and a Semiaqueous Residue Remover
p.284

Improvement of Silicon Solar Cell Substrates by Wet-Chemical Oxidation Studied by Surface Photovoltage Measurements
p.291

Simplified Cleaning for a-Si:H Passivation of Wafers Bonded to Glass
p.297

HomeSolid State PhenomenaSolid State Phenomena Vol. 219Focus Spot Reduction by Brush Scrubber Cleaning

Focus Spot Reduction by Brush Scrubber Cleaning

Abstract:

of preventive backside cleaning steps. These cleaning steps can be introduced after processes that generated high backside defect counts or right before a lithographic wafer exposure. In this study that was performed at imec’s 300mm cleanroom facility, the study objective was to evaluate the focus spot reduction performance of a stand-alone scrubber in a case study featuring known focus spot generating equipment sets. . In the first part of the study, monitoring of various production tools in terms of backside cross-contamination was done. A set of equipment’s that generated high backside defect counts was selected for generating adequate backside contaminated test material for the cleaning evaluation. This backside contaminated test material was used in our cleaning experiments and evaluation of focus spot reduction by performing leveling tests on an immersion scanner that was able to measure out of plane deviations.

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Periodical:

Solid State Phenomena (Volume 219)

Pages:

276-279

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.219.276

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Online since:

September 2014

Authors:

Antoine Pacco*, Els Kesters, Ihsan Simms, Kathleen Nafus, Jelle Vandereyken, Hiroki Yonekawa

Keywords:

Backside Cleaning, Backside Contamination, Brush, Chuck Spots, EUV, Focus Spots, Hot Spots, Immersion, Overlay, Scrubber

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* - Corresponding Author

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