Rapid Determination of Organic Contaminations on Wafer Surfaces

Sylke Meyer; Sebastian Timmel; Christian Hagendorf

doi:10.4028/www.scientific.net/SSP.219.317

Paper Titles

Upside-Down Residual Sessile Droplet: Watermarks on Wafers Backside
p.280

Nuclear Magnetic Resonance Spectroscopy of Trace Organic Impurities Extracted from a Corrosion Inhibitor and a Semiaqueous Residue Remover
p.284

Improvement of Silicon Solar Cell Substrates by Wet-Chemical Oxidation Studied by Surface Photovoltage Measurements
p.291

Simplified Cleaning for a-Si:H Passivation of Wafers Bonded to Glass
p.297

Investigation of Silicon Saw Damage Removal and Surface Texturing Using KOH for next Generation Silicon Solar Cells
p.300

Impact of Fe and Cu Surface Contamination on High Efficiency Solar Cell Processes
p.305

Ozone Base Cleaning: Impact on High Efficiency Interdigitated Back Contact Solar Cells
p.312

Rapid Determination of Organic Contaminations on Wafer Surfaces
p.317

Surface Cleaning and Passivation of Chalcogenide Thin Films Using S(NH₄)₂ Chemical Treatment
p.320

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Rapid Determination of Organic Contaminations on Wafer Surfaces

Abstract:

Irrespective of the semiconductor type and technology, organic contaminations on wafer surfaces have a detrimental impact on subsequent manufacturing steps and/or the device function. Therefore, it is of great interest to have a quick and reliable tool to detect those contaminations with sufficient sensitivity. In this study we investigated and optimized two methods which have the potential for in-line analytics since they are fast and simple: contact angle measurement and total organic carbon (TOC) determination. We present data on silicon wafer surfaces; however, the techniques may be suitable for all other wafer surfaces, too.