Thermal Stability of Anodic Layers on Aluminum Alloys

V. Sokol; V. Shulgov

doi:10.4028/www.scientific.net/SSP.230.14

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Thermal Stability of Anodic Layers on Aluminum Alloys

Abstract:

The thermal stability of anodic alumina layers made by the open circuit potential measurements and electron microscopy is discussed. The crack growth resistance of the anodic alumina layers has been studied depending on the initial aluminum alloy composition and the anodization regimes.

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Periodical:

Solid State Phenomena (Volume 230)

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14-18

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.230.14

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Online since:

June 2015

Authors:

V. Sokol, V. Shulgov

Keywords:

Aluminium Alloy, Aluminum (Al), Anodic Alumina, Crack, Heat Resistance

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References

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