Deformation Behavior of Semi-Solid ZCuSn10P1 Copper Alloy during Isothermal Compression

Abstract:

The isothermal compression tests of semi-solid ZCuSn10P1 alloy by strain induced melt activation (SIMA) process are carried out by Gleeble-1500 thermo-mechanical simulator, and the same tests are finished to samples of as-cast ZCuSn10P1 alloy. The deformation temperature respectively is 910°C, 920°C and 930°C, and the strain respectively is 0.4 and 0.6, the strain rate is 0.5s^-1, 1s^-1 and 10s^-1. The experimental results indicate that the deformation resistance of semi-solid ZCuSn10P1 copper alloy with smaller, more uniform and rounder solid grain is about half of the as-cast ZCuSn10P1 copper alloy. The deformation resistance of ZCuSn10P1 alloy by SIMA process decreases with the deformation temperature increasing, and the deformation resistance increases with the strain rate increasing.

• Periodical: Solid State Phenomena (Volume 256)
• Pages: 31-38
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.256.31
• Online since: September 2016
• Authors: Jia Wang, Rong Feng Zhou, Han Xiao, De Hong Lu, Lu Li, Dan Bai
• Keywords: Deformation Behavior, Isothermal Compression, Semisolid, ZCuSn10 Copper Alloy

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