On the Influence of Internal Void Size on the Fracture Stress of Constrained Solder Joints

Abstract:

The fracture strengths of thin solder joints were investigated experimentally and with Finite Element Analysis. Due to a constraining effect, thin solder joints can carry loads which are much higher than the ultimate tensile strength of bulk solder material. On the other hand, thin solder joints show a tendency of being brittle. In fact, the tensile properties show a dependence on the quality of the intermetallic compound at the interface to the base material. Consequently, the size of microscopic defects in the intermetallic compound has a dominant influence on the fracture stress. This behavior could nicely be explained with Finite Element simulations based on strain gradient elasticity.

• Periodical: Solid State Phenomena (Volume 258)
• Pages: 229-232
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.258.229
• Online since: December 2016
• Authors: Martin Lederer*, Golta Khatibi, Julien Magnien
• Keywords: Finite Element Method, Fracture Mechanics, Lead-Free Solder, Strain Gradient Theory

References

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