Synthesis and Properties of One-Component Addition-Crosslinking Silicone Resin

Dan Peng; Qiu Hong Mu; Jin Hui Li; Feng Wang

doi:10.4028/p-6c3k2d

Paper Titles

Preface

Preparation and Properties of VPCS/PMPS Composites
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Synthesis and Properties of One-Component Addition-Crosslinking Silicone Resin
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Effect of PC Percentages on Hardness and Notched Impact Strength of PBT/PC Blends
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Applying FCCCD Response Surface Method in Studying the Cutting Power of Wood Materials
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Inhibition Effect of Aminophen Fluid Derivative on the Corrosion of 1070 Aluminum
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Gravimetric and Statistical Data Analysis of the Protection Performance of Aloe vulgaris and Nicotiana tabacum Leaf Extracts on 1070 Aluminum and Mild Steel
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Flexural Behavior (Load-Strain Curve) of Reinforced Concrete Beams Covered by Gypsum Layers and Exposed to Elevated Temperatures
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HomeSolid State PhenomenaSolid State Phenomena Vol. 329Synthesis and Properties of One-Component...

Synthesis and Properties of One-Component Addition-Crosslinking Silicone Resin

Abstract:

A kind of MDT polysiloxane was prepared by step hydrolysis and polycondensation of alkoxysilane. It could be cured at elevated temperature with existence of microencapsulated platinum catalyst. The effects of crosslinkable groups’ contents and PhSiO_1.5content on properties of cured silicone resin were studied in detail. When the contents of crosslinkable groups were 20mol% to 30mol% and the PhSiO_1.5content was 25mol% to 30mol%, the cured silicone resin had good tensile strength, flexural strength, moderate elasticity, and low viscosity. With the increase of PhSiO_1.5content from 17mol% to 32mol%, T_g of the silicone resin could be improved by 50°C to 128°C. The thermal stability was explored by thermo gravimetric analysis. The onset temperature of thermal degradation and the center temperature of thermal degradation were 486°C and 548°C, respectively. The average dielectric constant was about 2.45 and the dielectric loss tangent value was less than 0.01. The silicone resin also showed a high-volume resistivity of 5.6×10¹⁶Ω•cm. These results suggest that such silicone resin is suitable for utilization in electronic packaging.

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International Symposium on Advanced Material Research V

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Periodical:

Solid State Phenomena (Volume 329)

Pages:

9-15

DOI:

https://doi.org/10.4028/p-6c3k2d

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Online since:

March 2022

Authors:

Dan Peng*, Qiu Hong Mu, Jin Hui Li, Feng Wang

Keywords:

Addition-Crosslinking, Low Dielectric Constant, Mechanical Properties, One-Component, Phenyl Silicone Resin

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References

[1] X.G. Wang, R.M. Zhang, D.D. Chen, et al, The Current State and Development Trend of WCu/MoCu Electronic Packaging Materials [J], Materials China, 37 (12) (2018) 1010-1016.

Google Scholar

[2] K. Shinji, U.S. Patent 2015344691. (2015).

Google Scholar

[3] D. Peng, Q.H. Mu, S. Zhang, et al, Synthesis and properties of phenyl silicone resin reinforced addition type liquid phenyl silicone rubber[J], Materials Science Forum, 926 (2018) 39-44.

DOI: 10.4028/www.scientific.net/msf.926.39

Google Scholar

[4] J.H. Li, B. Li, D. Peng, et al, Preparation of Microencapsulated Platinum Catalysts for Additive Liquid Silicone Impregnating Varnish [J], Chemical Industry and Engineering Progress, 38 (7) (2019) 3170-3175.

Google Scholar

[5] D. Peng, Q.H. Mu, S. Zhang, et al, Preparation and Properties of One Component RTV Silicone Resin Composed of Polysiloxane Block Copolymer [J], Materials Science Forum, 987 (2020) 64-69.

DOI: 10.4028/www.scientific.net/msf.987.64

Google Scholar

[6] Y. H.Shi, X. X. Gao, D. Zhang, et al, Synthesis and thermal properties of modified room temperature vulcanized (RTV) silicone rubber using polyhedral oligomeric silsesquioxane (POSS) as a cross linking agent [J], RSC Adv., 4 (78) (2014) 41453-41460.

DOI: 10.1039/c4ra06706a

Google Scholar

[7] Z. Z. Yang, L. Feng, S. Diao, et al, Study on the synthesis and thermal degradation of silicone resin containing silphenylene units [J], Thermochim. Acta, 521 (1-2) (2011) 170-175.

DOI: 10.1016/j.tca.2011.04.020

Google Scholar

[8] C. Yuan, J.J. Wang, K.K. Jin, et al, Postpolymerization of functional organosiloxanes: an efficient strategy for preparation of low-k material with enhanced thermostability and mechanical properties [J], Macrololecules, 47 (18) (2014) 6311-6315.

DOI: 10.1021/ma501263c

Google Scholar