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Online since: May 2010
Authors: Roald E. Taymanov, Ksenia Sapozhnikova
(April 2008), p. 20.
3.
De Bievre: Metrologia. 45 (2008), p. 335. 5.
Eren, Chun Che Fung, in: Electrical Engineering, edited by Wong Kit Po, in Encyclopedia of Life Support Systems (EOLSS), developed under the Auspices of the UNESCO (EOLSS Publishers, Oxford ,UK 2006), information on http://www.eolss.net 7.
Vol. 94, 7 (2008), p. 1. 13.
Sapozhnikova, in: Proceedings of the 12th IMEKO TC1 - TC 7 Joint Symposium, Annecy, France (September 2008), p. 212, information on http://www.imeko.org
De Bievre: Metrologia. 45 (2008), p. 335. 5.
Eren, Chun Che Fung, in: Electrical Engineering, edited by Wong Kit Po, in Encyclopedia of Life Support Systems (EOLSS), developed under the Auspices of the UNESCO (EOLSS Publishers, Oxford ,UK 2006), information on http://www.eolss.net 7.
Vol. 94, 7 (2008), p. 1. 13.
Sapozhnikova, in: Proceedings of the 12th IMEKO TC1 - TC 7 Joint Symposium, Annecy, France (September 2008), p. 212, information on http://www.imeko.org
Online since: July 2012
Authors: Xi Wen Qin, Hong Yu Zhang, Xiao Gang Dong
In: Automatic Face & Gesture Recognition, Amsterdam, The Netherlands, 2008: 1 – 6
[5] T.F.Cootes, C.J.Taylor, D.Cooper,GKC.
Wong, F.Y.
Teoh, A new scheme for automated 3D PDM construction using deformable models, Image and Vision Computing 26(2) (2008) 275–288
Pattern Recognition, 41(3):833-851(2008) [21] Y.
Maechler: Matrix: A Matrix package for R (2008). cran.r-project.org/web/packages/Matrix/index.html.
Wong, F.Y.
Teoh, A new scheme for automated 3D PDM construction using deformable models, Image and Vision Computing 26(2) (2008) 275–288
Pattern Recognition, 41(3):833-851(2008) [21] Y.
Maechler: Matrix: A Matrix package for R (2008). cran.r-project.org/web/packages/Matrix/index.html.
Online since: July 2013
Authors: Tamal Ghosh, Ashudeb Dutta, Shivgovind Singh
Gutmann and L.Rafael Reif Wafer level 3D ICs process technology, 2008, pp.1-18
[2] Lim, D.F.; Wei, J.; Leong, K.C.; Tan, C.S.; , "Temporary passivation of Cu for low temperature (< 300°C) 3D wafer stacking," Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International , vol., no., pp.1-3, 8-12 May 2011
[3] Peng, L.; Li, H.Y.; Lim, D.F.; Gao, S.; Tan, C.S.; , "Thermal reliability of fine pitch Cu-Cu bonding with self assembled monolayer (SAM) passivation for Wafer-on-Wafer 3D-Stacking," Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st , vol., no., pp.22-26, May 31 2011-June 3 2011
[4] Ang, X.F.; Lin, A.T.; Wei, J.; Chen, Z.; Wong, C.C.; , "Low Temperature Copper-Copper Thermocompression Bonding," Electronics Packaging Technology Conference, 2008.
EPTC 2008. 10th , vol., no., pp.399-404, 9-12 Dec. 2008 [5] Akitsu Shigetou, Toshihiro Itoh, Mie Matsuo, Nobuo Hayasaka, Katsuya Okumura and Tadatomo Suga “Bumpless interconnect through ultrafine Cu electrodes by means of Surface-Activated Bonding(SAB) method” IEEE transactions on advanced packaging,vol.29, 2006 [6] Dau Fatt Lim; Singh, S.G.; Xiao Fang Ang; Jun Wei; Chee Mang Ng; Chuan Seng Tan; , "Application of self assembly monolayer (SAM) in lowering the process temperature during Cu-Cu diffusion bonding of 3D IC," Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009.
EPTC 2008. 10th , vol., no., pp.399-404, 9-12 Dec. 2008 [5] Akitsu Shigetou, Toshihiro Itoh, Mie Matsuo, Nobuo Hayasaka, Katsuya Okumura and Tadatomo Suga “Bumpless interconnect through ultrafine Cu electrodes by means of Surface-Activated Bonding(SAB) method” IEEE transactions on advanced packaging,vol.29, 2006 [6] Dau Fatt Lim; Singh, S.G.; Xiao Fang Ang; Jun Wei; Chee Mang Ng; Chuan Seng Tan; , "Application of self assembly monolayer (SAM) in lowering the process temperature during Cu-Cu diffusion bonding of 3D IC," Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009.
Online since: June 2011
Authors: Jun Li, Yong Wei Zhu, Ping Gao, Biao Li, Yan Zhang, Ji Long Fan, Yu Li Sun, Bi Liang Jiang, Dun Wen Zuo
., Vol. 36 (2008), p.1178 (in Chinese)
[2] N.
Technol., Vol. 205 (2008), p.34 [9] Z.
Solid., Vol. 354 (2008), p.2023 [11] L.
Wong, T.
Dissertation, National University of Defense Technology, China, 2008).
Technol., Vol. 205 (2008), p.34 [9] Z.
Solid., Vol. 354 (2008), p.2023 [11] L.
Wong, T.
Dissertation, National University of Defense Technology, China, 2008).