Search results

Materials and Method 1.
According to the classical dielectric theory, the refractive index depend on density and on polarisabilities of the atom in a given materials [5].
A facile synthesis method of hierarchically porous NiO nanosheets, Materials Letters 69: 69-71
Properties of CoO doped in Glasses Prepared from Rice Hush Fly Ash in Thailand, Materials Science and Engineering 18: 112008
International Journal of Engineering Science and Technology 3: 6998-7005

Zhang, Applied Surface Science 264 (2013) 162-170
Zhang, Materials Science in Semiconductor Processing 10 (2007) 215-221
Muhamad, Journal of Solid State Chemistry 183 (2010) 1733-1739
Chakraborty, Materials Chemistry and Physics 122 (2010) 18-22
Hahn, Journal of Crystal Growth 282 (2005) 131-136.

Once a water hammer occurs during slurry transportation, pipe fractures and breakage could result in the leakage of hazardous materials.
The abscissa represents the acoustic impedance of the particle, which is listed for the various materials in Table 1.
Shepherd: Structural Response of Piping to Internal Gas Detonation, Journal of Pressure Vessel Technology, Vol. 131, No. 3, (2009), 031204
Liou: Acoustic wave speed for slurries in pipelines, Journal of Hydraulic Engineering, Vol. 110, (1984), pp. 945-957
Masuyama: Study on the Motion of Particles in a Solid-Liquid Two-Phase Flow in a Horizontal Pipe, Journal of the Mining and Materials Processing Institute of Japan,106(1), (1990), pp. 21-28

The presence of hard SiC particles in Aluminium Matrix Composites (AMCs) poses considerable difficulties when machining these materials and also leads to rapid tool wear.
The difficulties associated with the machining of AMCs must be minimized if these materials are to be used more extensively.
Rao, “Wear and Friction of Cast Al-SiC-Gr Composites” Proceedings from Materials Solutions 97 on Wear of Engineering materials, 15th–18th September, 1997, Indianapolis, Indiana, pp 205-211
Paulo Davim “Optimization of machining parameters of Al/SiC-MMC with ANOVA and ANN analysis”, Journal of Materials Processing Technology, (2008) doi:10.1016/j.jmatprotec.2008.01.041
Taplin “The turning of an Al/SiC metal matrix composite”, Journal of Materials Processing Technology, 33 (1992), 453- 468

Lin, Materials Science and Engineering A, 480 477 (2008)
Lin, Journal of Polymer Science: Part B: Polymer Physics, 46 949 (2008)
Cheng, Materials Letters, 64 1992 (2010) [23] L.
Bhushan, Journal of Colloid and Interface Science, 360 777 (2011)
Hom, Journal of Intelligent Material Systems and Structures, 10 195 (1999)

Sample and Tensile Testing Material and Sample Geometry.
References [1] Cheng S, Huang C-M, Pecht M 2017 Microelectronics Reliability 75 77 [2] Nogita K, Greaves M C, Guymer B D, Walsh B B, Kennedy J M, Duke M D, Nishimura T 2010 Transactions of The Japan Institute of Electronics Packaging 3 104 [3] Lin Y-W, Lin K-L 2013 Intermetallics 32 6 [4] Moon K-W, Boettinger W J, Kattner U R, Biancaniello F S, Handwerker C 2000 Journal of electronic materials 29 1122 [5] Yokoi M, Kobayashi T, Shohji I Materials Science Forum p2081-2086 [6] Schwartz M 2014 Soldering: Understanding the basics (ASM International) [7] Lai Y-S, Song J-M, Chang H-C, Chiu Y-T 2008 Journal of Electronic Materials 37 201 [8] Hidaka N, Watanabe H, Yoshiba M 2009 Journal of electronic materials 38 670 [9] Hasnine M, Vahora N 2018 Journal of Materials Science: Materials in Electronics 29 8904 [10] Yang T 2007 Master's thesis, Harbin University of Science and Technology
[11] Azman D I N A, Osman S A, Narayanan P, Kozutsumi Y 2024 Journal of Advanced Research in Micro and Nano Engineering 17 69 [12] Yi J, Zhang Y, Xu L, Liu S, Yang Y 2017 Electronic Components and Materials 31(3) 49-52
[13] Yahaya M Z, Mohamad A A 2017 Soldering & Surface Mount Technology 29 203 [14] Pang J H L 2011 Lead Free Solder (Springer) [15] Kim J-W, Kim D-G, Jung S-B 2005 Metals and Materials International 11 121 [16] Tada N, Nishihara R, Masago H 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) p145-148 [17] Jang W-L, Wang T-S, Lai Y-F, Lin K-L, Lai Y-S 2012 Microelectronics Reliability 52 1428 [18] Nogita K, Salleh M A M, Smith S, Wu Y, McDonald S D, Razak A G A, Liu S, Akaiwa T, Nishimura T 2017 Transactions of The Japan Institute of Electronics Packaging 10 E17 [19] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N 2015 Applied Mechanics and Materials 754 513 [20] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N Materials Science Forum p161-166 [21] Johansson J, Belov I, Johnson E, Dudek R, Leisner P 2014 Microelectronics Reliability 54 2523 [22] George.E., Das.D., Osterman.M.,
Pecht.M. 2011 Transcations on Device and Materials Reliability 11 328 [23] Kanlayasiri K, Kongchayasukawat R 2018 Transactions of Nonferrous Metals Society of China 28 1166 [24] Ma H, Suhling J C J J o m s 2009 44 1141 [25] Abtew M, Selvaduray G 2000 Materials Science and Engineering: R: Reports 27 95 [26] Bai N, Chen X, Fang Z 2008 Journal of electronic materials 37 1012 [27] Xu Y, Gu T, Xian J, Giuliani F, Britton T B, Gourlay C M, Dunne F P 2022 Materials Science and Engineering: A 855 143876 [28] Shohji I, Yoshida T, Takahashi T, Hioki S 2004 Materials Science and Engineering: A 366 50 [29] El-Taher A, Abd Elmoniem H, Mosaad S 2023 Journal of Materials Science: Materials in Electronics 34 590 [30] Zhu F, Zhang H, Guan R, Liu S, Yang Y 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits p239-243

Vieregge, Recent development in aluminium alloys for the automotive industry, Materials Science and Engineering, 280 (2000) 37-49
Dean, Formability and failure mechanisms of AA2024 under hot forming conditions, Materials Science and Engineering: A, 528 (2011) 2648-2656
Ghosh, Biaxial warm forming behavior of aluminum sheet alloys, Journal of Materials Processing Technology, 145 (2004) 281-293
Ragneau, Cruciform shape benefits for experimental and numerical evaluation of sheet metal formability, Journal of Materials Processing Technology, 213 (2013) 856-863
Tiernan, A review of planar biaxial tensile test systems for sheet metal, Journal of Materials Processing Technology, 198 (2008) 1-13

Computational model By use of standard mean variables in material sciences, we analyze the special feature of the non-Newtonian equations, for the resistance to the extensional and simple shear [12,13].
Fig.2 The effective boundar-layer stress on each time step in the numeric computing Apart from solving mathematic model; using FEM to analyze the numerical solution; and data analysis for the boundary layer [8-11], we also developed further understanding for the non-Newtonian materials in the impact model of the crash safety experiment.
[5] Hou,L.and Nassehi V , Evaluation of the stress effects flow in rubber mixing, Nonlinear analysis, Elsevier Sciences, Journal， 47- 3, （2001）1809-1820
Fleck, Size effect in constrained deformation of metallic foams [J], Journal of the Mechanics and Physics of Solids, 50(2002), 955-977
[13] X.James Ren and Vadim V.Silberschmidt, Numerical modeling of low-density cellular materials [J], Computational materials Science. 2008(43): 65-74.

AlN crystals are one of the representative III-V group semiconductor materials.
Experimental Method This experiment adopts the simulation method to act out the temperature field of AlN growth chamber, the original structure as shown in Figure 1, the chamber is made of high purity tungsten materials, and heating process can avoid secondary pollution.
The temperature distribution of seed is low, the surface temperature of materials is high, the central temperature is high, and the edge temperature is low.
Mass transfer in AlN crystal growth at high temperatures, Journal of Crystal Growth 264.1 (2004) 369-378
AlN PVT growth process through global heat transfer modeling and simulations, Journal of Crystal Growth 474. (2016)

Materials Science Forum. 1068 (2022) 215–222
Materials Science Forum. 1038 (2021) 33–39
Materials Science Forum. 1006 (2020) 47–54
Materials Science Forum. 1068 (2022) 231–238
Materials Science Forum. 1038 (2021) 15–24