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References [1] NFC-Forum, Available: http://www.nfc-forum.org
[4]Dominikus S, Aigner M. mCoupons: An application for near field communication (NFC)[C]//Advanced Information Networking and Applications Workshops, 2007, AINAW'07. 21st International Conference on.
Building a contactless university examination system using nfc[C]//Intelligent Engineering Systems (INES), 2011 15th IEEE International Conference on.

Processing and Characterization of Magnesium Alloys Hwa Chul Jung a and Kwang Seon Shin b School of Materials Science and Engineering Research Institute of Advanced Materials Seoul National University, Seoul 151-742, Korea a junghc1@snu.ac.kr, bksshin@snu.ac.kr Keywords: Magnesium Alloys, Manufacturing Process, Characterization, Alloy Design Abstract.
Forum Vol. 419-422 (2003), p. 851 [16] S.C.
Forum, Vol. 419~422 (2003), p. 159

Forum(2003) p419 [2] A.
Arslan Kaya: Advanced Engineering Materials, 5, No. 12 (2003) p. 866 [8] H.
Maruyama, : Materials Science Forum, Vol. 544-545 (2007) P. 295 20� Crack (a) (b)

This special volume of journal "Materials Science Forum" is intended to disseminate the recent advances in both conventional and nonconventional technologies of materials removal and covers many aspects of modern scientific and engineering practice in area of materials machining.
Topics include: grinding and polishing, abrasive finefinishing, micro- and nanomachining, ultrasonic and laser machining, surface integrity and materials characterization, as well as other advanced cutting technologies and etc.
This book will be useful for academics and practicing engineers in advancement of the efficient materials removal technologies for modern mechanical engineering.
Hashimoto Advanced Finishing Technology, USA M.J.
Li CSIRO Earth Science and Resource Engineering, Australia Associate Members Y.

The conference is an international forum for the presentation of technological advances and research results in the fields of Mechanical, Industrial, and Manufacturing Technologies.
Yuesheng Zhu, Peking University Shenzhen Graduate School, China Program Co-Chairs Dr.Murthy Rallapalli, IBM / Stevens Institute of Technology, USA Dr.Yogesh Varma, Electrical and Computer Engineering Department, College of Engineering, University of Oklahoma Norman, USA Prof.
Wen-Yeuan Chung, Department of Mechanical Engineering, Chinese Culture University, Taiwan Prof.Kazuaki Maeda, Chubu University, Japan Prof.
Kulkarni,Mechanical Engineering in BITS Pilani, K K Birla Goa Campus, India Prof.Mohamed El Bachir Menai, Department of Computer Science, King Saud University, Saudi Arabia Dr.
Ing.Kay Smarsly, Ruhr-University Bochum Institute for Computational Engineering, Germany Prof.

In fact, a clear picture of the defect behavior in SiC during a postimplantation thermal process is necessary for a defect engineering that preserves the as implanted doping profiles, maximizes the electrical activation of the implanted species and eliminates the step bunching phenomenon at the wafer surface.
Svensson: Advances in Silicon Carbide Processing and Applications, S.
Forum 527-529 (2006), p. 803 [9] H.
Forum 389-393 (2002), p. 807 [10] M.
Forum 527-529 (2006), p. 795 [20] V.

Tomota2,b 1JSPS Research Fellow, Institute of Applied Beam Science, Graduate School of Science and Engineering, Ibaraki University, Hitachi City, Ibaraki 316-8511, Japan 2 Professor, Institute of Applied Beam Science, Graduate School of Science and Engineering, Ibaraki University, Hitachi City, Ibaraki, Japan a aminulislam_7136@yahoo.com, b tomota@mx.ibaraki.ac.jp Key Words: IF steel, Tensile strength, Fatigue, Crack nucleation, Intergranular cracking, Transgranular fracture.
Spiradek-Hahn: Proc. of International Forum for the properties and application of IF steels, edited by H.
Stiaszny: Proc. of International Forum for the properties and application of IF steels, edited by H.
Park: Proc. of International Forum for the properties and application of IF steels, edited by H.
Larour: Proc. of International Forum for the properties and application of IF steels, edited by H.

Development of Ferromagnetic Sputtering Targets with High Performance Junfeng Luo1,a*, Yunyi Fang2,b, Guojin Xu1,c, Yongjun Li1,d and Xiaodong Xiong1,e 1Grikin Advanced Materials Co.
Ltd., Beijing Engineering Research Center of High Purity Metal Sputtering Targets, Beijing 102200, China 2Department of physics, Beijing Normal University, Beijing 100875, China aljf@grikin.com, bvictorffy@sohu.com, cxgj@grikin.com, dlyj@grikin.com, exxdbear@grikin.com Keywords: Microstructure, Ferromagnetism, High purity, PTF, Sputtering target Abstract.
The preparation methods of high performance ferromagnetic sputtering targets (including cobalt, nickel-platinum and nickel-iron alloy) for advanced semiconductor manufacturing were introduced.
Microelectronic engineering, 2014, 120(10): 34-40
Influence of microstructure on pass through flux of high purity Ni, Materials Science Forum, 2016, 848: 696-702

San Juan1,c. 1Dpto Física de la Materia Condensada, Facultad de Ciencia y Tecnología, Universidad del País Vasco, Aptdo 644, 48080 Bilbao (Spain) 2Dpto Física aplicada II, Facultad de Ciencia y Tecnología, Universidad del País Vasco, Aptdo 644, 48080 Bilbao (Spain) 3Dpto Física de la Materia Condensada, Facultad de Física, Universidad de Sevilla, Aptdo 1065, 41080 Sevilla (Spain) 1,bmiguel.castillo@ehu.es (corresponding author) and 1,cjose.sanjuan@ehu.es Keywords: Mechanical spectroscopy, advanced ceramics, internal friction, nano-materials.
Engineering ceramics are being developed to improve their high-temperature mechanical properties and in particular creep resistance.
Although this study is now in progress, we may advance some interesting previous results.
San Juan, Materials Science Forum 366-368 (2001) 32-73

Preface MAEE2013 is a comprehensive conference,and it is an integrated conference concentrating its focus upon Material Engineering and Electrical Engineering.
In the proceeding, you can learn much more knowledge about Material Engineering and Electrical Engineering of researchers all around the world.
In order to meet high standard of Advanced Material Research,the organization committee has made their efforts to do the following things.
The goal of the conference is to provide researchers from Material Engineering and Electrical Engineering fields with a free exchanging forum to share the new ideas, new innovation and solutions with each other.