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Online since: July 2012
Authors: A. Crosky, Masitah Abu Kassim, David Ruys
Ruys2,c
1Bio-Composite Technology Program, Faculty of Applied Sciences, Universiti Teknologi MARA (UiTM), 40450 Shah Alam, Selangor Darul Ehsan, Malaysia
2School of Engineering Materials, The University of New South Wales, Sydney, Australia
amasitah3909@salam.uitm.edu.my, ba.crosky@unsw.edu.au, cr.david@unsw.edu.au
Keywords: Water absorption, material modification, kenaf fibre, flax fibre
Abstract.
Flexural properties of flax and kenaf composites were determined according to the American Society for Testing and Materials (ASTM) D790.
The materials were supplied by the Institute of Natural Fibres in Poznan, Poland.
Journal Application Composite Material, 7, 373-385. (2000)
Journal Composite Science and Technology, 57, 67-79. (1997).
Flexural properties of flax and kenaf composites were determined according to the American Society for Testing and Materials (ASTM) D790.
The materials were supplied by the Institute of Natural Fibres in Poznan, Poland.
Journal Application Composite Material, 7, 373-385. (2000)
Journal Composite Science and Technology, 57, 67-79. (1997).
Online since: July 2011
Authors: Xiao Chuan Li
Over the years, a large amount of studies have been done in mechanics, materials science and physics fields [2-5].
For load (a): . (32) For load (b): . (33) For load (c): . (34) For numerical calculation, the composite materials BaTiO3-CoFe2O4 are specified, which material constants are given in [5].
Ni: Journal of Magnetism and Magnetic Materials Vol. 321(2009). p. 1867 [4] W.
Leung, et al: Journal of Zhejiang University SCIENCE Vol. 6A(2005). p. 922 [11] W.
Shen: International Journal of Engineering Science Vol. 41(2003). p. 85
For load (a): . (32) For load (b): . (33) For load (c): . (34) For numerical calculation, the composite materials BaTiO3-CoFe2O4 are specified, which material constants are given in [5].
Ni: Journal of Magnetism and Magnetic Materials Vol. 321(2009). p. 1867 [4] W.
Leung, et al: Journal of Zhejiang University SCIENCE Vol. 6A(2005). p. 922 [11] W.
Shen: International Journal of Engineering Science Vol. 41(2003). p. 85
Online since: July 2013
Authors: Xue Jun Li, Yong Yi Gao, Kuan Fang He, Xi Zou, Jian Jian Kun
VSR Mechanism based on MC algorithm Simulation of Grain Growth Behavior of Sustainable Materials
Xi Zou1,a, Xuejun Li2,b, Yongyi Gao3,c, Kuanfang He4,d, kun Jianjian5,e
1,2,3,4,5Hunan Provincial Key Laboratory of Health Maintenance for Mechanical Equipment, Hunan University of Science and Technology, Xiangtan, 411201, China
a284195782@qq.com, bhnkjdxlxj@163.com, cgaoyongyi5188@163.com,
dhkf791113@163.com, emnjk333@sina.com
Keywords: MC algorithms, grain growth, VSR, mechanism
Abstract.
Acknowledgements Financial support from National Natural Science Foundation of China (51175205) the scientific research fund of Hunan provincial education department (11A034), the CEEUSRO special plan of Hunan province (2010XK6066) and the aid program for science and technology innovative research team in higher educational institutions of Hunan province, the outstanding master degree thesis cultivation project of Hunan University of science and technology (S110111), are gratefully acknowledged.
Beijing: Metallurgical Industry Press. (1994) [5] Chao Wang, Guoquan Liu, Xiangge Qin, Journal of University of Science and Technology Vol. 35-4(2010), p. 226~229 [6] Jixiang Zhang, Xiaojun Guan, Sheng Sun.
Journal of Shandong University(Engineering Science) Vol. 35-4(2005), p. 1~5 [7] Zhenyu Ma, Yaping,Lu Shushi Jia, Mechanical Science and Technology Vol. 20-4(2001), p. 587-589
Acknowledgements Financial support from National Natural Science Foundation of China (51175205) the scientific research fund of Hunan provincial education department (11A034), the CEEUSRO special plan of Hunan province (2010XK6066) and the aid program for science and technology innovative research team in higher educational institutions of Hunan province, the outstanding master degree thesis cultivation project of Hunan University of science and technology (S110111), are gratefully acknowledged.
Beijing: Metallurgical Industry Press. (1994) [5] Chao Wang, Guoquan Liu, Xiangge Qin, Journal of University of Science and Technology Vol. 35-4(2010), p. 226~229 [6] Jixiang Zhang, Xiaojun Guan, Sheng Sun.
Journal of Shandong University(Engineering Science) Vol. 35-4(2005), p. 1~5 [7] Zhenyu Ma, Yaping,Lu Shushi Jia, Mechanical Science and Technology Vol. 20-4(2001), p. 587-589
Online since: November 2013
Authors: Dong Hyuk Cha, Myung Jin Chung
According to type of material, organic, metal, and inorganic material board are used in PCB.
Kashani: Journal of Materials Processing Ttechnology Vol. 213 (2013), pp.1095-1102 [3] J.W.
Jung: Journal of Materials Science, Materials in Electronics Vol. 23 (2012), pp.41-47 [4] J.G.
Jung: Journal of the Microelectronics and Packaging Society, Vol. 18 (2011) pp.63-67 [5] M.
Rudramoorthy: Journal Ultrasonics Vol. 53 (2013), pp.763-772 [6] M.G.
Kashani: Journal of Materials Processing Ttechnology Vol. 213 (2013), pp.1095-1102 [3] J.W.
Jung: Journal of Materials Science, Materials in Electronics Vol. 23 (2012), pp.41-47 [4] J.G.
Jung: Journal of the Microelectronics and Packaging Society, Vol. 18 (2011) pp.63-67 [5] M.
Rudramoorthy: Journal Ultrasonics Vol. 53 (2013), pp.763-772 [6] M.G.
Online since: June 2017
Authors: Sheng Ping Wen, Yu Sheng Ding, Hui Huang, Xiao Lan Wu, Xiao Lei Yan, Qian Yang, Zuo-Ren Nie, Kun Yuan Gao
Acknowledgements
The study is supported in part by the National Key Research and Development Program of China (2016YFB0300801 and 2016YFB0300804), National Natural Science Foundation of China (51671005), Beijing Natural Science Foundation (2162006), Beijing Municipal Science and Technology Project (Z161100002116004) and Program on Jiangsu Key Laboratory for Clad Materials (BM2014006).
References [1] Li Long, Nagai Kotobu, Yin Fuxing, Progress in cold roll bonding of metals[J], Science and Technology of Advanced Materials. 2008, 9(2): 1-11
Kajihara, Growth behavior of Fe2Al5 during reactive diffusion between Fe and Al at solid-state temperatures[J], Materials Science and Engineering A. 459 (2007) 375-382
Chang, Diffusion coefficients of some solutes in fcc and liquid Al: critical evaluation and correlation[J], Materials Science and Engineering A.363 (2003) 140–151
Srivastava, Growth of intermetallic layer at roll bonded IF-steel/ aluminum interface[J], Journal of materials processing technology. 195(2008): 88–93
References [1] Li Long, Nagai Kotobu, Yin Fuxing, Progress in cold roll bonding of metals[J], Science and Technology of Advanced Materials. 2008, 9(2): 1-11
Kajihara, Growth behavior of Fe2Al5 during reactive diffusion between Fe and Al at solid-state temperatures[J], Materials Science and Engineering A. 459 (2007) 375-382
Chang, Diffusion coefficients of some solutes in fcc and liquid Al: critical evaluation and correlation[J], Materials Science and Engineering A.363 (2003) 140–151
Srivastava, Growth of intermetallic layer at roll bonded IF-steel/ aluminum interface[J], Journal of materials processing technology. 195(2008): 88–93
Online since: April 2011
Authors: Li Na Wang, Zhao Xi Deng, Yan Wei Wang
Resulting materials can produced into products with greater performance and at reduced cost.
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Online since: November 2006
Authors: Norio Kawagoishi, Qing Yuan Wang, Q. Chen, M. Oki
Material and Experimental Procedure
The material used was an extruded age-hardened Al alloy 7075-T6 whose chemical composition
(wt%) was 0.09Si, 1.47Cu, 0.25Fe, 0.03Mn, 2.56Mg, 0.19Cr, 5.46Zn, Zr+Ti0.03, 0.03Ti and
remainder Al.
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Nagata, Fatigue & Fracture of Engineering Materials & Structures, Vol.25 (2002), p.735
Tanimura, Journal of the Society of Materials Science, Japan, Vol.47 (1998), p.1053
Waldron, Journal of Materials Science, Vol.6 (1971), p.319
Sayama, Journal of the Society of Materials Science, Japan, Vol.31 (1982), p.383
Online since: November 2012
Authors: Qiang Song Wang, Guo Liang Xie, Xiang Peng Xiao, Lijun Peng, Bai Qing Xiong
[8] Lockyer S A, Noble F W: Materials Science and Technolog.
Hah, Alan J Ardell: Journal of Materials Science.
[12] Dongfeng Wang, Buxi Kang, Liu Ping: Ordnance Material Science and Engineering (In Chinese).
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Uhenwinkel: Materials Science and Technology.
Hah, Alan J Ardell: Journal of Materials Science.
[12] Dongfeng Wang, Buxi Kang, Liu Ping: Ordnance Material Science and Engineering (In Chinese).
Uhenwinkel: Journal of Materials Processing Technology.
Uhenwinkel: Materials Science and Technology.
Online since: March 2012
Authors: Bin Gao, Xian Hai Yang, Xiang Cheng, Jun Ying Liu
Hard and brittle materials such as silicon and ceramic materials are difficult to machining due to their brittle properties.
By the ductile-mode machining, delicate features with high accuracy can be created on these materials by mechanical micro/nano machining.
However, these materials are very brittle.
In ductile-mode machining, brittle materials can be machined in a ductile-mode with good surface finish and no surface pitting or cracking.
Yamazaki, Design and development of PCD micro straight edge end mills for micro/nano machining of hard and brittle materials, Journal of Mechanical Science and Technology, 24 (11) (2010) 1-8
By the ductile-mode machining, delicate features with high accuracy can be created on these materials by mechanical micro/nano machining.
However, these materials are very brittle.
In ductile-mode machining, brittle materials can be machined in a ductile-mode with good surface finish and no surface pitting or cracking.
Yamazaki, Design and development of PCD micro straight edge end mills for micro/nano machining of hard and brittle materials, Journal of Mechanical Science and Technology, 24 (11) (2010) 1-8
Online since: December 2012
Authors: Nor Aishah Jasli, Ramani Mayappan, Hamidi Abd Hamid
Wu, Law, C.M.T., Yu, D.Q., Wang, L.: Journal of Electronic Materials Vol. 32 (2003), p. 63-69
Wu: Materials Chemistry and Physics Vol. 123 (2010), p. 629-633
Kivilahti: Materials Science and Engineering: R: Reports Vol. 49 (2005), p. 1-60
Chan: Materials Science and Engineering: A Vol. 445–446 (2007), p. 686-690
Lee C.S.: Journal of Electronic Materials Vol. 35 (2006), p. 1660-1664 [11] L.
Wu: Materials Chemistry and Physics Vol. 123 (2010), p. 629-633
Kivilahti: Materials Science and Engineering: R: Reports Vol. 49 (2005), p. 1-60
Chan: Materials Science and Engineering: A Vol. 445–446 (2007), p. 686-690
Lee C.S.: Journal of Electronic Materials Vol. 35 (2006), p. 1660-1664 [11] L.