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The contour numbers represent power dissipation efficiency.
Recrystallized grain size is fine (less than 8 μm) in the segregation area of SiC particles.
However, coarse grain with the size of more than 10 μm distribute in the scarcity area of SiC particles.
The presence of a large number of dislocations near the SiC particles can improve the nucleation rate of the matrix alloy and promote the dynamic recrystallization of the matrix alloy [22-24].
Frazier, Effect of prior β-grain size on the hot deformation behavior of Ti-6Al-4V: Coarse vs coarser, Journal of Materials Engineering and Performance. 9 (2000) 153-160.

Prior to testing, the specimens of both groups were cut into slices of Ø100×48 mm (number of slices per composition: 12; number of slices for self-healing test: 6).
The reaction of hydrocarboxylic acids with the calcium ions of the clinker grains results in the formation of a barrier around them, which prevents the access to water, subsequently, inhibiting the hydration process.
Hydration of isolated clinker grains, which initially remained unhydrated due to the effect of DCAs, occurred; at the same time Ca2+ ions, leached from the concrete matrix, reacted with water producing portlandite that precipitated in the crack space.
The healing process is due to the formation of CaCO3 from Ca(OH)2, and dissolved CO2 and the hydration of anhydrous clinker grains.

Jet-abrasive camera KSO-110-IFV-RM was employed for the practical study of the of liquid blasting (LB) modes influence on the surface roughness. 13A electrocorundum with 120 grain size (GOST 28818) was chosen as an abrasive material.
The cutting instrument was the abrasive disk with following properties: the material of the abrasive grains was green silicon carbide (96% ... 97% SiC); grain size was 80 (F24); hardness was medium-soft (L), the structure was open (8); the bond was of bakelite (B).
The research has demonstrated that in a selected range of spraying modes there are significant changes in the structural characteristics, such as porosity, pore size, and the number of unfused particles.
Depending on the processing allowance calculated on the basis of the known methods, one selects the cutting depth providing the minimum number of grinding passes which contributes to the maximum processing performance.

Hardening the solder with the addition of nanoparticles and stabilizing the grain structure should result in increased reliability [4].
The effects of additions of metallic particles on the microstructure, wettability and other mechanical properties of the composite solders have been reported in a number of studies.
It was reported that a reduction of grain size can lead to the reduction of melting point as the excess energy stored in the grain boundaries as well as the capillarity reduces the total enthalpy of melting [13,14].
The degree of anisotropy of Sn grains, the size of Sn dendrite arms and the distribution of second phases was closely related to the mechanical behaviour of the solder joints [18].

Some meters have a number of different scales, or different plug-in modules, for different groups of species. [2] Effects of Grain Direction.
Relative conductivity values in the longitudinal, radial, and tangential directions are related by the approximate ratio of 1.0:0.55:0.50.[4] That is why it is always necessary to be specified in which direction of the grain should be probes installed.
The measurement was performed both perpendicular and parallel to the grain and then compared with oven-drying method.
Comparison of wood moisture content measured by resistance method perpendicular and parallel to the grain with oven-drying method.

The size of abrasive grains was approximately 1.5 µm.
Although a slight surface undulation can be identified in the figure, no crystalline grain boundary or defects are observed.
This is presumably due to the irregularity in the shape and distribution of abrasive grains.
(3) Excellent subsurface microstructure uniformity can be achieved through overlapping irradiation, which forms no crystalline grain boundaries
The proposed technique offers a number of advantages.

Figure 4 Kinetic curves of copper and tin leaching from non-thermal treated PCBs with various grain sizes In the process of acidic leaching in HCl solution the amount of leached copper is lower of tin.
The reduction of PCB grain size results in an increase of the reaction surface between liquid and solid phase, which has a positive influence on the extraction of metals into the solution [7].
Lower grain sizes of samples have a positive influence on the extraction in both cases.
The smaller the grain sizes of PCBs are the higher reaction surface becomes, which positively affects the extraction of metals into the solution.
Williams, Processing waste printed circuit boards for material recovery, Circuit World, Volume 33, Number 4, 2007, 43–50 [7] T.

Furthermore, it can be assumed that some characteristics of the DMD process thermal behaviour are applicable to SLM where the temperature gradient in the wall increases with the number of deposited layers until a critical height where the temperature becomes isotherm.
The first heat treatment considered was an annealing at 1250°C for 4h followed by an air quench and a furnace ageing at 900°C for 4h also followed by an air quench, giving rise to a duplex microstructure consisting of lamellar γ+α2 grains as well as γ grains.
The grain size is respectively 10 and 25µm for the SLM and DMD processes.
Once again, the microstructure is found to be coarser for the DMD process with an average grain size around 400µm against 200µm for the SLM process.

Surface chemistry of LP-limestone also contributes to the reduction of water. (2) For LP-sandstone, high content of clay mineral which has a large number of imperfects, flaw and interspaces, and the molecule of water and water-reducing agent are liable to enter into the unfilled pores, giving rise to the loss of a large quantity of water.
The fluidity of mortar can be increased by addition of LP-pebble and LP-limestone, which may be due to two factors. (1) The rollball effect of limestone powder between the sand grain and cement particle, sand grain and sand grain and cement particle and cement particle, reduce the slipping resistance among these particles.
And the addition of limestone powder optimizes the grain gradation, facilitate the motion of mortar and increase the fluidity of mortar. (2) The water requirement of LP-pebble and LP-limestone is lower than that of the cement.

Introduction Straw is a natural product being generated from a waste product, i.e. inert fibrous stalks left after the edible part of the grain has been harvested.
In McCabe (1994) master’s thesis is mentioned that the insulation value differs depending on weather the bales are measured with or against the “grain” (Straw is lined up within the bales, allowing air and heat to pass through more easily in one direction than the other.).
The average of thermal resistance R value (where R=1/U) for the wheat straw bales is 2.4 per inch equivalent to a U of 0.42 W/m2.K (λ=0.061 W/m.K) with the grain and 3.2 per inch equivalent to a U of 0.31 W/m2.K (λ=0.046 W/m.K) against the grain [7].
A number of temperature readings having the same or nearly the same temperature value are needed before reaching a steady heat flow.