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The fatigue life, N25, was determined as the number of cycles when the tensile stress decreased by 25% from the maximum tensile stress.
As the grain boundaries and the interfaces of inclusions/matrix are strong trapping sites for the absorbed hydrogen, the hydrogen concentration at these sites would be high and then the local stress can be increased by the absorbed hydrogen [6,9].
Therefore, at the grain boundaries and the interfaces of inclusions/matrix, the crack growth may be accelerated by the absorbed hydrogen, thereby reducing the fatigue life of SA508 Gr.1a LAS at the strain rates of 0.04 and 0.4 %/s in 310 o C deoxygenated water.

The combine among grains became infirm or microcracks formed on grain boundaries because of the volume change after polarization treatment.
Acknowledgements This project was supported by National Natural Science Foundation of China under grant number 50372015.

So the semisolid slurry with fine primary grains and remnant liquids can be prepared.
The study on this coupled process is a basic work for the research of the nucleation and growth of grains.
The critical condition for the change from lamellar flow to turbulent flow depends on the Reynolds number, (1) (2) Where ν is the Kinetic viscosity of the melt, μ is the dynamic viscosity, ρ is the density of the melt, V∞ is the whole flow velocity of the melt and that x is the flow distance on the plate.

The grain size of thin films is increased with the increase of oxygen pressures.
It is suggested that the behavior of bleaching and coloration reaction of the NiO films in the LiClO4 solution are great influenced by the numbers of grain boundary and nano-crack.

When the number of hydrogen ions of the reaction gas increase, which increase the probability of the atoms collisions, chemical bond length will become larger than before because of the increase of hydrogen content ,free energy and surface mobility decline, thus all these factors leading to enhanced adsorption reaction and larger deposition rate [11].
Thin film becomes dense, and the grain size becomes smaller, but the deposition rate was lower at this time, which is related to the high-speed etching of H [12].
Zhai, et al: Influence of Hydrogen Flow on Grain size of Nano-crystalline SiC Films Grown by HFCVD Method.

The use of hypereutectic silumin in the manufacture of the parts of internal combustion engines is limited by low level of mechanical characteristics, namely, low plasticity owing to high content of primary grains of silicon with micron size [4-7].
The following electron-beam treatment parameters were used: the energy of accelerated electrons was 18 keV, the energy density of the electron beam was 40 J/cm2, the pulse repetition rate was 0.3 s-1, the pulse duration was 200 µs and the number of pulses was 20.
The size of crystal grains of silicon reached 35 µm.

There is now ample experimental evidence that the net volume increase accompanying a solid state internal reaction may result in a number of deformation phenomena including creep and grain-boundary sliding [1-3].
Numerous surface nodules (protuberances) consisting of virtually pure base metal (nickel), free of precipitated material or dissolved chromium can be seen within the grains.

Moreover, with aluminium, there are few numbers of other variables which need to be considered during the filler alloy selection process.
The significant clear grain can be noticed in weld-made using ER4043 in comparison to the ER5356.
The formation of the clear grain in ER4043 during welding can be attributed to dendrite formation.

Order to generate a coarse-grained mineral tremolite, tremolite, fine-grained tremolite, talc, serpentine leaf .
Larger-scale faults in the area for the xiangfang main fault zone, composed of a number of faults, the impact width 1Km or so, the fault zone in the northern study area, to the north east - north east, north west orientation - North West, the streak inverse homogeneous-like mixture of rock strata complex in the Liaohe Group, and in the north down into the ground fault block.

Introduction PMN-PT thin/thick films have attracted increasing attention as a candidate material for a number of applications in microelectronics and microelectromechanical systems (MEMS), such as multilayer capacitors, ultrasonic transducers, microsensors and microactuators.
It can be seen that the surface of the film is very flat and the particles are deposited densely on the substrate with a fine granular grain size and some residual porosity.
The grain size range is 1.0 to 3.0 µm.