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Han 1 1 School of Microelectronic Engineering, Griffith University, Nathan Campus, Queensland 4111, Australia, 2 School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia.
Dimitrijev: Proc. 3 rd International Conference on Recent Advances in Materials, Minerals and Environment 2003, p. 44
Schroder: Advanced MOS Devices (Addison-Wesley, Reading 1987) p.163
Pierret: Advanced Semiconductor Fundamentals (Addison-Wesley, Reading 1987), p. 160
Forum Vol. 433-436 (2003) p. 583.

Cascolan4,f 1DR3AM Center, Bataan Peninsula State University – Main Campus, Tenejero, Balanga City, Bataan, Philippines 2100 2Department of Industrial Engineering, College of Engineering and Architecture, Bataan Peninsula State University – Main Campus, Balanga City, Bataan, Philippines 2100 3Department of Mechanical Engineering, College of Engineering and Architecture, Bataan Peninsula State University – Main Campus, Balanga City, Bataan, Philippines 2100 4Pangasinan State University, Pangasinan, Philippines 5Nanotechnology R&D Facility, Central Luzon State University, Nueva Ecija, Philippines ajrcdizon@bpsu.edu.ph, brnmdelda@bpsu.edu.ph, cmsvelasco@bpsu.edu.ph, djuvymonserate@clsu.edu.ph, elncancino.lingayen@psu.edu.ph fhmcascolan.asingan@psu.edu.ph, Keywords: additive manufacturing, 3D printing, nanosilica, thermosets, mechanical properties Abstract. 3D printing is now being used in many different applications.
Forum. 1005 (2020) 157–165, doi: 10.4028/www.scientific.net/msf.1005.157
Advincula, “3D-printing and advanced manufacturing for electronics, Prog.
In Woodhead Publishing Series in Composites Science and Engineering, Structure and Properties of Additive Manufactured Polymer Components, Woodhead Publishing, Elsevier Inc., 2020
Ling, Nanocomposites for engineering applications, J.

References * Present address: International University Bremen, School of Engineering and Science, D-28725 Bremen, Germany
Forum Vols. 457-460 (2004) p.1321
Forum Vols. 457-460 (2004) p.1317
Starke: Atomic structure of SiC surfaces, in Silicon Carbide, Recent Major Advances (eds: W.J.

Effects of Aluminum Content on Plastic Formability of Wrought Mg Alloy Sheet Produced by Twin-roll Casting Process Hisaki Watari1,a ,Yoshimasa Nishio1,b, Mayumi Suzuki2,c , Toshio Haga3,d, Keith Davey4,e and Nobuhiro Koga 5,f 1 Graduate School of Engineering, Dept. of Production Science and Technology, Gunma University, 29-1, Hon-cho, Ohta, Gunma, 373-0057, Japan 2 Graduate School of Environmental Studies, Dept. of Material Science and Engineering, Eco-material Design and Process Engineering,6-6-02, Aoba, Aramaki, Aoba-ku, Sendai, Miyagi,980-8579, Japan 3 Graduate School of Engineering, Osaka Institute of Technology, Dept. of Mechanical Engineering, 5-16-1 Omiya Asahi-ku Osaka, 535-8585, Japan 4.The University of Manchester, School of Mechanical, Aerospace and Civil Engineering, PO BOX 88 Sacville Street, Manchester, M60 1QD, UK 5 Nippon Institute of Technology, Dept. of Mechanical Engineering, 4-1 Gakuen-dai, Miyashiro-machi, Minami-Saitama-gun, Saitama-ken, 345-850, Japan awatari
Forum, Vol. 511-551(2007), p.357 [2] R.
Koga, Advanced Materials Research, Vol. 97-101(2010), p.1077 [8] S.
Higashi, Advanced Materials Research, Vol. 145-148(2007), p.145

A New Framework for Evaluation Index System of Regional Science and Technology Wenming Yang 1,a, Weijin An 2,b * 1 School of Management, Tianjin University, Tianjin 300072, China 2 School of Mechanical Engineering, Tianjin University, Tianjin 300072, China a Wyang@tju.edu.cn， banweijin@tju.edu.cn * Correspondence to Weijin An，Emai: anweijin@tju.edu.cn.
The greatest influence of the evaluation system including "global competitiveness report", present by international institute for management development (IMD) in lausanne, Switzerland; “the world competitiveness yearbook”, present by world economic forums (WEF); "technical achievement index" (TAI) in "human development report", present by the United Nations development programme (UNDP); the technology statistic index system present by organization for economic cooperation and development (OECD), etc.
Therefore, this article introduces the advanced idea of system dynamics and the balanced scorecard, makes a deep analysis of the related factors in regional S&T development, and explore the inner relationship between various factors and mechanism, thus establishing a new, more scientific index system that reflect our country's regional science &technology development.
[2] Hu Li, Chunlin Liu, Jianjun Shi: China science and technology forum, Vol. 2 (2005), p.120-124, in Chinese

Stover: in Proceedings of the 6th Liege Conference on Materials for Advanced Power Engineering, Edited by J.
Forum Vols. 312-315 (2011), p. 577 [21] G.
Forum Vols. 312-315 (2011), p. 583 [38] D.A.

Characterization of Epoxy Matrix Reinforced with Banana Fibers Thermal Properties by Photoacoustic Technique Foluke Salgado de Assis1,a, Frederico Muylaert Margem 1,b, Pedro Amoy Netto1,c, Roberto da Trindade Faria Jr.1,d, Thallis Custódia Cordeiro1,e, Fabio de Oliveira Braga2,f and Sergio Neves Monteiro2,g 1State University of the Northern Rio de Janeiro, UENF, Advanced Materials Laboratory, LAMAV; Av.
Alberto Lamego, 2000, 28013-602, Campos dos Goytacazes, RJ, Brazil. 2Military Institute of Engineering - IME, Department of Materials Science; Praça General Tibúrcio, 80, Praia Vermelha, Urca, RJ, CEP 22290-270, Urca, Rio de Janeiro, RJ, Brazil.
Oliveira: Mater Sci Forum Vols. 775-776 (2014), p. 250
Oliveira: Mater Sci Forum.

The Role of Air-Pocket in Crucible Structure for High Quality SiC Crystal Growth Seung Jun Lee1,a, Su Ho Kim1,b, Jung Woo Choi1,c, Jong Hwi Park1,d, Jung Gyu Kim1,e, Kap Ryeol Ku1,f, Ha Lin Lee2,g, Gi Uk Lee2,h and Won Jae Lee2,i* 1Senic, 17-15, 4sandan 7-ro, Jiksan-eup, Seobuk-gu, Cheonan-si, Chungcheongnam-do, Korea 2Department of Advanced Materials Engineering, Dong-Eui University, 176, Eomgwang-ro, Busanjin-gu, Busan, Korea asjlee@senic.co.kr, bshkim@senic.co.kr, cjwchoi@senic.co.kr, djhpark@senic.co.kr, ejgkim@senic.co.kr, fkrku@senic.co.kr, ghalinlee99@naver.com, hdlrldnr7774@naver.com, ileewj@deu.ac.kr Keywords: 4H-SiC Growth, PVT, Air pocket, C/Si ratio, Graphite structure Abstract.
Forum, Vol. 858 (016), p.5 [2] E.
Forum, Vol. 483-485 (2005), p. 21 [3] A.

Analysis on the Residual Stresses in the Aluminum Alloy Friction Stir Welded Joints Lijie Cao College of Mechanical Engineering, Shanghai University of Engineering and Science, Shanghai , 201600,China clj@sues.edu.cn Keywords: Friction Stir Welding, Aluminum Alloy, Joints, Residual Stress.
The residual stress fields can have strong influences on the integrity and performance of friction stir welded aluminum alloy structure, comprehensive insight into the residual stress distribution is the key to the Friction stir welding (FSW) engineering application for a wide range of materials and thicknesses improving the weld strength and fatigue life.
Maximum longitudinal stress was reported to be about 65MPa on the retreating side and about 55MPa on the advancing side.
Thirdly, in order to ensure safety and reliability of FSW structures, the residual stresses level and regularity of distributions should be researched from the degree on engineering application, Further works are proposed for the influence of residual stresses in FSW on mechanical characteristics, particularly fatigue properties.
Forum Vol.347–349 (2000),p. 678 [9] Mir Zahedul H.

150 mm SiC Engineered Substrates for High-Voltage Power Devices Séverin Rouchier1,a*, G.
In this paper, we report the latest advances in the development of such so called SmartSiC™ substrates.
Thereby the engineered SmartSiC™ substrate is epi-ready and the epitaxy growth process to be performed is simpler than for conventional SiC wafers, as the conversion buffer layer is already done.
Figure 4: Picture of a Smart SiC™ substrate Intensive physical, chemical and electrical characterizations have been conducted on the SmartSiC™ to assess the performance of the engineered substrate.
Materials Science Forum.