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Online since: October 2013
Authors: Kai Zeng, Xiao Cong He, Cheng Jiang Deng, Hui Yan Yang, En Liu, Sen Zhou
Introduction Clinching is a cold forming process for the joining of metal sheets or other material.
However, Image processing is a fully non-destructive and non-contact measurement tool and it has been widely used to examine the deformations of engineering materials [4,5].
[2] Zheng Junchao, He Xiaocong, Finite element analysis of energy saving jointing method base on energy materials: Clinching, Advanced Materials Research, 577 (2012), 9-12
Materials review, 5(2012), 140-143
[5] Li Gang, He Shuanhai, Ju Yongfeng, Image-based method for concrete bridge crack detection, Journal of Information and Computational Science,8(2013), 2229-2236.
Online since: January 2014
Authors: Nikolas Sinji Harada, Renata Bastos de Araujo, Marcelo Augusto Vieira de Souza, Wang Shu Hui, Luiz Claudio de Santa Maria
Experimental Materials.
Ratner: Classes of materials used in medicine.
Ratner (Ed), Biomaterials science: an introduction to materials in medicine 2nd edition, Elsevier Inc., 2004, p.88-92
Bhattarai: Journal of Biomedical Materials Research Part B: Applied Biomaterials Vol. 67B (2) (2003), p. 675
Lee: Journal of Applied Polymer Science Vol. 114 (2009), p. 3652
Online since: October 2010
Authors: Jin Hong Ma, Wen Zhi Zhang, Wei Chen, Biao Wu
The material in simulation and experiment is Q235.
Hot rolling technique and profile design of tooth shape rolls- Development and research on H-beam with wholly corrugated web(WCW)(1).Journal of Materials Processing Technology,2000,101(1-3):111-115 [2] Yanwen Li, Wenzhi Zhang et al..
Buckling strength analysis of the web of WCW H-beam- Development and research on H-beam with wholly corrugated web(WCW)(2).Journal of Materials Processing Technology,2000,101(1-3):116-119 [3] Elgaaly M., Anand Seshadri.
Journal of Yanshan university, 2003,27(3) 278~282.
(In Chinese) [5] Theoretical foundation and Case Analysis of LS-DYNA3D, Peking: science press, 2005:30-44 Advanced Materials Research Vols. 83-86 229
Online since: February 2013
Authors: Zhong Hua, Jing Mei Ma, Feng Ye
Bansal, Celsian formation in fiber-reinforced barium aluminosilicate glass-ceramic matrix composites, Materials Science and Engineering A. 342 (2003) 23-27
Bansal, Crystal growth kinetics in BaOAl2O32SiO2 and SrOAl2O32SiO2 glasses, Journal of Material Science. 31 (1996) 172-184
Bansal, CVD SiC fiber-reinforced barium aluminosilicate glass-ceramic matrix composites, Materials Science and Engineering A. 220 (1996) 129-139
Drummond, Effect of isostatic pressing on phase formation in BaO·Al2O3·2SiO2 glass, Journal of Materials Science Letters 13 (1994) 53-55
Zhou, Toughness of Ceramics, in: Science of Ceramic Materials, Science Press, China, 2004, pp. 227-228
Online since: July 2012
Authors: Jia Mu Huang, Xi Meng, Wei Chen, Shi Yu Sui
American Society for Testing and Materials (ASTM) standard D 3359-09 cross cut tape test was performed to examine the adhesion between the film and substrate.
References [1]Guangling Song, Recent progress in corrosion and protection of magnesium alloys, Advanced engineering materials. 7(2005)564-586
Zhang, Microstructure and mechanical properties of Ti(C,N) and TiN/Ti(C,N) multilayer PVD coatings, International Journal of Refractory Metals & Hard Materials. 26 (2008) 456-460
Paris, C.Schreuders, Microstructure analysis of RF plasma synthesized TiCN nanopowders, International Journal of Refractory Metals & Hard Materials. 26 (2008) 277-285
Kwok, On the initial growth of indium tin oxide on glass, Journal of Applied Physics. 68 (1996)2663-2665
Online since: January 2026
Authors: Ikuo Shohji, Tatsuya Kobayashi, Marina Oyama, Kenta Kawaguchi, Keishi Nakamura, Koichi Hirasawa, Hitoshi Amemiya
Zhu, Electromigration in eutectic SnAg solder reaction couples with various ambient temperatures and current densities, International Journal of Minerals, Metallurgy and Materials 16 (2009) 685-690
Thompson, Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer, Journal of Alloys and Compounds 862 (2021) 158043
Kim, Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints, Journal of Materials Science: Materials in Electronics 30 (2019) 7645-7653
Yamanaka, Electromigration in Solder Joints, Journal of The Japan Institute of Electronics Packaging 23 (2020) 219-223
Liu, Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package, Journal of Materials Science & Technology 34 (2018) 1305-1314.
Online since: July 2017
Authors: Roland Haubner, Mario Lessiak
Setaka, Growth of diamond particles from methane-hydrogen gas, Journal of Materials Science 17(11) (1982) 3106-3112
Gruen, Nanocrystalline Diamond Films, Annual Review of Materials Science 29 (1999) 211-259
Kalss, Diamond deposition on hardmetal substrates - Comparison of substrate pre-treatments and industrial applications, International Journal of Refractory Metals & Hard Materials 28 (2010) 475-483
Calmano, Studies on electrochemical treatment of wastewater contaminated with organotin compounds, Journal of Hazardous Materials, 146-3 (2007) 540-545
Lessiak, Diamond coatings on carbon based substrates, Materials Science Forum, 825-826 (2015) 605 - 612.
Online since: December 2010
Authors: Feng Zhang Ren, Feng Jun Li, An Ke Cai, Ding Xiang Tang, Hong Li Dong
Experiments and Results The main materials used in this experiment include pig iron, scrap steel and returns.
Journal of Materials Processing Technology, 2006, 179: 165-171
Charge materials and technology of melt and structure of gray cast iron.
Journal of Materials Processing Technology 162-163 (2005) 465-470
Journal of Materials Processing Technology 160 (2005) 183-187
Online since: December 2010
Authors: Hong Ping Zhu, Jing Yu
Since piezoelectric materials exhibit strong temperature dependency.
Journal (A) Vol. 42 (1999), p. 249 ].
Elongation by electric field Remanent polarization elongation The direct and converse piezoelectric effects of piezoelectric materials can be described by piezoelectric equations found by Tiersten in 1969 [[] H.F.
Soh, in: Smart Materials, Structures, and Systems, edited by S.
Acknowledgements The authors would like to extend their thanks to the joint financial support by National Natural Science Fund of China (50778077) and National Science Fund for Distinguished Young Scholars (50925828).
Online since: November 2012
Authors: Tibor Czigány, Anna Czeller
Materials and methods Materials.
[2] Murphy E.B., Wudl F.: The world of smart healable materials.
Annual Review of Materials Research. 40 (2010) 179-211
Journal of Microencapsulation. 20 (2003) 719-730
European Polymer Journal. 34 (1998) 193-199