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Cu3P and Ni2P are brittle compounds, which may reduce the mechanical strength of the brazed joints.
The mechanism of interface formation involving metallized glass differs from that of active filler alloys.
In metallized glass, Cu is already in contact with the glass surface, whereas the use of active filler alloys requires the migration of Cu from the alloy onto the glass.
At the interface of the brazed joint, it can be determined that Cu3P and Ni2P intermetallic compounds, and α-Cu and CuxSny layer have formed.
The brittle compounds Cu3P and Ni2P are mainly responsible for lowering the strength of the brazed joints.

The present paper shows the experimental results obtained on two complex alloys Co-Cr-W-C-Fe-Ni-Si-Mn-Mo and Ni-Cr-Fe-B-Si-C-Co alloys deposited on copper support by welding (TIG).
The present paper shows some Ni complex alloys (Deloro) and Co complex alloys (Stellite) behaviour, chosen as protection coatings for blast furnace tuyeres, aiming to increase their operating life [1,2].
The compounds partial solubilisation hypothesis is supported by SEM images and EDS analyses.
It leads to rounding off edges and corners of primary compounds.
Xiao ş.a., The electronic, mechanical properties and theoretical hardness of chromium carbides by first principle calculation, Journal of Alloys and Compounds, 509 (2001) 5242-5249.

In this work, the Cambridge Sequential Total Energy Package (CASTEP) was used to calculate the Fermi energy of compounds, and the valence electrons were represented by the ultrasoft pseudopotential (USP) method.
As is mentioned above, the second phases in both Al-Zn-Sn-Ga and Al-Zn-Sn alloys were Al-Zn compound of which the Fermi energy is higher (know as lower corrosion potential) than that of GB zone and Al matrix.
The different potential in the alloys will lead to local couple corrosion. 2.
Journal of Applied Electrochemistry, 2004, 34(10): 1071-1080
Journal of Applied Electrochemistry，1999, 29(9): 1063~1071

The aim of this study is to design magnesium alloys that are capable of forming precipitate during hot deformation.
Baker, ASM Specialty Handbook: Magnesium and Magnesium Alloys.
Lee, Grain refining of magnesium alloy AZ31 by rolling, Journal of Materials Processing Technology, 140 (2003) 588-91
Park, The microstructure, tensile properties, and creep behavior of AZ91, AS52 and TAS652 alloy, Journal of Alloys and Compounds, 493 (2010) 502-506
Niu, The microstructure, tensile properties, and creep behavior of as-cast Mg-(1-10)%Sn alloys, Journal of Alloys and Compounds, 440 (2007) 122-126

And the aim of these researches is reducing the consumption of Cu bond in solders [8-10], which is opposite to our study.
And these studies emphasize on the effect of copper content in solder to accelerate or decelerate the dissolution of copper bond pad and the growth kinetics of the inter-metallic compounds.
Molt point of Cu-72Ag brazing alloys is about 780℃ and molt point of Cu-7P brazing alloys is about 800℃.
Chan: Journal of Applied Physics Vol. 94 (2003), p. 7904 [7] M.
Tasdemirci, Nair F.: Journal of Materials Processing Technology Vol. 141 (2003), p. 302 [8] S.

Today, lead-free solder alloys such as Sn-Ag and Sn-Ag-Cu developed very aggressively.
There are two types of copper-beryllium, highly conductive alloys with 0.3-0.5 % beryllium content and high-strength alloys with 1.7-2.0 % beryllium content [5].
Nagel, (2018): Beryllium and Copper-Beryllium Alloys.
Wang, (2010): The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during soldering.
Journal of Alloys and Compounds, 492(1–2), 433–438.

The addition of strontium to the Mg-Al based alloys which was aimed at replacing AE alloys initially can avoid these problems.
The strength at elevated temperatures in Mg-Al-Sr alloy was as high as that of Mg-Al-Zn alloys.
The type of intermetallic compounds appearing in Mg-Al-Sr alloys depends on the ratio of Sr/Al.
JOM-journal of the minerals metals metals & materials society 55 (11): A34-A39 NOV 2003 [5] Kinji Hirai, Hidetoshi Somekawa, Yorinobu Takigawa, Kenji Higashi, Eeffcts of Ca and Sr addition on properties of a cast AZ91 magnesium alloy at room and elevated temperature.
International Journal of Cast Metals Research 17 (3): 170-173 2004 [7] LIU Xiangguo, PENG Xiaodong, XIE Weidong, WEI Qunyi.Preparation, Technologies and Application of Strontium-Magnesium Master Alloys, Materials Science Forum, Vol.488-489, June 2005, pp:31-34 [8] Xu R.

Besides, XRD analysis on the deposits of electroplated Zn-Sn-Ni alloy shows Zn in the deposits exist in the form of metal compound, including δ phase Ni3Zn22 as well as γ Ni5Zn21.
On the one hand, most of them focus on binary alloy electroplating, for example Zn-Ni alloy or Zn-Sn alloy.
This shows that the metal Zn of the deposits exists in the form of metal compound.
Fig. 2 XRD Pattern of Zn-Sn-Ni Deposits with Compound Additives Nucleation Mechanism of Electrodeposition of Zn-Sn-Ni Alloys.
Pushpavanam: International Journal of Hydrogen Energy Vol. 27 (2002), p. 627 [4] Elkhatabi, F, M.

The aim of the work was a comprehensive study of the structural, magnetic, and magnetostrictive characteristics of Sm0.5Gd0.5Fe2 and Sm0.5Tb0.5Fe2 compounds and their comparison with similar SmFe2 characteristics obtained by us earlier [17, 18].
In order to equalize the composition of the obtained polycrystalline alloys the homogenizing annealing was performed.
AFM and MFM images of Sm0.5Gd0.5Fe2 (a, b) and Sm0.5Tb0.5Fe2 (c, d) alloys surface.
Fabrication, magnetostriction properties and applications of Tb-Dy-Fe alloys: a review, China Foundry. 13(2) (2016) 75-84
Nikitin, Magnetocaloric effect in (Tb,Dy,R)(Co,Fe)2 (R = Ho, Er) multicomponent compounds, Journal of Physics: Conference Series, 266 (2011) 012077(5)

"Aluminium Alloys-New Trends in Fabrication and Applications."
Journal of Alloys and Compounds, 2012, vol. 536, p.
[4] ASM Handbook, Alloys Phase Diagrams, vol. 3, 1998, pp. 9–26, 635
Journal of Alloys and Compounds, 2012, vol. 529, p. 58-62
Journal of Physics: Condensed Matter, 1997, vol. 9, no 50, p. 11077