The Dissolution Mechanism of Copper Weld Brazing with Cu-Based Brazing Alloys

Abstract:

In this paper, the dissolution mechanism of copper weld brazing has been researched. The thickness losses of Cu foil in contact with molten Cu-P and Cu-Ag binary alloys at different temperatures have been studied. And the dissolution rate constants in both alloys is calculated and exists following relation: k_Cu-P (T)=10k_Cu-Ag (T), which explains the special phenomenon that the dissolving amount of copper in Cu-P liquid alloys is larger than that in Cu-Ag liquid alloys by using weld brazing technology. The dissolution rate of copper in filler metals is the main reason to realize weld brazing. It can be concluded that element P is indispensable in filler metals as the function of accelerating dissolution during weld brazing.

• Periodical: Materials Science Forum (Volumes 697-698)
• Pages: 394-398
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.697-698.394
• Online since: September 2011
• Authors: Yi Nan Li, Z.L. Peng, J.C. Yan
• Keywords: Dissolution Rate Constant, Dissolving Ability of Ag, Dissolving Ability of P, Temperature, Weld Brazing

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