The Dissolution Mechanism of Copper Weld Brazing with Cu-Based Brazing Alloys
In this paper, the dissolution mechanism of copper weld brazing has been researched. The thickness losses of Cu foil in contact with molten Cu-P and Cu-Ag binary alloys at different temperatures have been studied. And the dissolution rate constants in both alloys is calculated and exists following relation: kCu-P (T)=10kCu-Ag (T), which explains the special phenomenon that the dissolving amount of copper in Cu-P liquid alloys is larger than that in Cu-Ag liquid alloys by using weld brazing technology. The dissolution rate of copper in filler metals is the main reason to realize weld brazing. It can be concluded that element P is indispensable in filler metals as the function of accelerating dissolution during weld brazing.
Tian Huang, Dawei Zhang, Bin Lin, Anping Xu, Yanling Tian and Weiguo Gao
Y. N. Li et al., "The Dissolution Mechanism of Copper Weld Brazing with Cu-Based Brazing Alloys", Materials Science Forum, Vols. 697-698, pp. 394-398, 2012