In this paper, the dissolution mechanism of copper weld brazing has been researched. The thickness losses of Cu foil in contact with molten Cu-P and Cu-Ag binary alloys at different temperatures have been studied. And the dissolution rate constants in both alloys is calculated and exists following relation: kCu-P (T)=10kCu-Ag (T), which explains the special phenomenon that the dissolving amount of copper in Cu-P liquid alloys is larger than that in Cu-Ag liquid alloys by using weld brazing technology. The dissolution rate of copper in filler metals is the main reason to realize weld brazing. It can be concluded that element P is indispensable in filler metals as the function of accelerating dissolution during weld brazing.