Improving Low-Ag Pb-Free Solder Performance by Adding Bi, Ni Elements

Feng Lian Sun; Yang Liu; Yang Liu; Jia Bing Wang; Hong Wu Zhang

doi:10.4028/www.scientific.net/AMR.189-193.3498

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 189-193Improving Low-Ag Pb-Free Solder Performance by...

Improving Low-Ag Pb-Free Solder Performance by Adding Bi, Ni Elements

Abstract:

In this study, some Ni, Bi elements were added into low-Ag (less than 1%) Sn-Ag-Cu (SAC) solder. The effect of these additive elements on the solderability, intermetallic compounds (IMCs), and electromigration performance of low-Ag SAC (LASAC) solder were investigated. With the increase of Bi content in LASAC-0.05Ni-xBi (x=0, 2.0, 2.5, 3.0, 3.5, 4.0) solders, the peak melting point decreases while the wetting area of solder alloy increases. With the addition of Ni, the IMC between Cu pad and LASAC solder transforms from Cu6Sn5 to (Cu1-xNix)6Sn5 and the morphology of the IMC turns from bulk-like to needle-like. Either the addition of Bi or Ni will slow down the IMCs growth rate during high temperature storage aging (HTS) at 180°C and has a positive effect on electromigration performance of LASAC soldering.

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Periodical:

Advanced Materials Research (Volumes 189-193)

Pages:

3498-3502

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.189-193.3498

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Online since:

February 2011

Authors:

Feng Lian Sun, Yang Liu, Yang Liu, Jia Bing Wang, Hong Wu Zhang

Keywords:

Electromigration, HTS Aging, IMC, Solderability

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References

[1] Kannachai Kanlayasiri and T. Ariga: Journal of Alloys and Compounds Vol. 504 (2010), p. L5.

Google Scholar

[2] Yong'An Su, Long Bin Tan, Tan, V.B. C, and Tong Yan Tee: EPTC 09 p.283.

Google Scholar

[3] Weiping Liu and Ning-Cheng Lee: Journal of the Minerals, Metals and Materials Society Vol. 59 (2007), p.26.

Google Scholar

[4] Keke Zhang, Yaoli Wang, Yanli Fan, Jie Yiang, Yanfu Yan, and Xin Zhang: Key Engineering Materials Vol. 353-358 (2007), p.2912.

Google Scholar

[5] Sheng Lu, Fei Luo, Jing Chen, and Kaiyue Li: IPFA 09 p.782.

Google Scholar

[6] Jie Zhao, Chengyu Chi, and Congqian Cheng: Chin Shu Hsueh Pao Vol. 44 (2008), p.473.

Google Scholar

[7] D.Q. Yu and L. Wang: Journal of Alloys and Compounds Vol. 458 (2008), p.542.

Google Scholar

[8] Henry Y. Lu, Haluk Balkan, and K.Y. Simon Ng: Journal of Materials Science: Materials in Electronics Vol. 17 (2006), p.171.

Google Scholar

[9] P. Liu, P. Yao, and J. Liu: Journal of Alloys and Compounds. Vol. 486 (2009), p.474.

Google Scholar

[10] K.S. Kim, S.H. Huh, and K. Suganum: Microelectronics Reliability. Vol. 43 (2003), p.259.

Google Scholar