Search results

In this study, the strains of artificial rock were analyzed in order to estimate the deformation behavior of rock-like materials in the SHPB test.
Kolsky: An investigation of the mechanical properties of materials at very high rates of loading, Proc. of the Physical Society, Section B, London (1949) 676-700
Tedesco: Split-Hopkinson pressure-bar tests on concrete and mortar in tension and compression, ACI Materials Journal 86 (1989) 475-481
ACI Materials Journal 92(1) (1995) 37-47
Williams: Modeling of local impact effects on plain and reinforced concrete, ACI Materials Journal 91(2) (1994), 178-187

Electronics devices consist of silicon chips, copper leads, substrates and other parts which are jointed to each other with solder, conductive adhesive or other materials.
Sn-Ag-Cu, epoxy resin, and Cu3Sn alloy are focused as the bonding materials.
Analysis Model, Materials and Conditions.
The depth of the slits in the Cu lead was the most effective structure parameters and the effects are dependent with the joint thickness and materials.
Morida, “Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag2O for Packaging of High-temperature Electronics”, Materials Science Forum, Vol.706-709 (2012), 2962-2967

Journal of Business Research, 57, 338-346
Journal of Business Ethics, 26, 181-195
Journal of Business Ethics, 16, 473-484
Journal of Business Ethics, 15, 635-644
The Journal of Academy of Marketing Science, 27, 19-35

The polishing pad is one of the most important consumable materials: when the wafer is polished, the pad surface asperity changes.
Introduction Progress in science and technology depends substantially on innovations from the semiconductor industry.
Recently, it was found that the material removal rate during polishing is affected by the actual contact conditions between the wafer and the polishing pad [1].
The polishing pad is one of the most important consumable materials: the polishing pad surface asperity has a substantial influence on the actual contact conditions.
References [1] J John McGrath and Chris Davis: Polishing pad surface characterization in chemical mechanical planarization, Journal of Materials Processing Technology, 153-154 (2004) 666-673

China 2Department of Mechanical Engineering, University of Washington, Seattle, WA 98195, USA 3National Laboratory for physical sciences at the microscale, University of Science & Technology of China, Anhui, 230026, P.
Experiment Materials.
All the materials were used without further processing or purification.
Chonan: Journal of Intelligent Material Systems and Structures.
Matsuura: Journal of Membrane Science.

Introduction Magnesium alloys as a most light commercial metal structure material have a series of good properties such as high specific strength and stiffness, high damping performance, antimagnetic, shielding, fine heat emission and so on.
Acknowledgement The authors acknowledge gratefully the financial support from the Nation Science Foundation (No. 51075132), the Science Fund of State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body (No. 30815007).
References [1] I.Rieiro, V.Gutierrez, J.Castellanos, M.Carsi, M.T.Larrea and O.A.Ruano: Metallurgical and Materials Transactions A, Vol.41 (2010) No.9, p.2396 [2] Yong Qi Cheng, Hui Zhang, Zhen Hua Chen and Kui Feng Xian: Journal of Material Processing Technology, Vol.208 (2008) No.1-3, p.29 [3] N.Yazdipour, C.H.J.Davies, and P.D.Hodgson: Computational Materials Science, 2008, 44, p566 [4] D.Rabbe: The Simulation of Materials Microstructure and Properties (Wiely-VCH, 1998) [5] JIN Zhao-yang and CUI Zhen-shan: Journal Of Shanghai Jiaotong University, Vol.44 (2010) No.4, p.437 [6] Avrami M: Journal of Chemical Physis, 1939, (7), p.1103 [7] A.Laasraoui and J.J.Jonas: Metallurgical and Materials Transactions A, Vol.22 (1991) No.7, p.1545 [8] E.I.Poliak and J.J.Jonas: Acta Materialia, Vol.44 (1996) No.1, p.127 [9] Sellars CM and Mctegart WJ: Acta Metallurgica, 1966, 14(9), p.1136 [10] Zener C and Hollomon H.J: Appl Phys, 1944, 15(1), p.22

According to the analysis result, optimization is made to save material appropriately.
Fig. 2 Loads setting of the frame The frame is made of structural steel and its main materials parameters are as follows: Density 7850kg/m3, Young’s modulus 200 GPa, Poisson’s ratio 0.3 and Yield strength 250 MPa.
Considering from the aspect of saving materials, optimization should be implemented to decrease the material on the premise of ensuring the yield strength.
Conclusion This paper analyzed the strength and stiffness of the combine harvester frame, discussed the analysis result and took an optimization objective to increase equivalent stress appropriately and save materials.
References: [1] Dongjie Zhao, Chunjiang Bao and Lipeng Zhang: Machine Design and Research, Vol. 26(2010), p. 102 (In Chinese) [2] Guang Ma, Dongming Huang, Zhiming Wang: Journal of Zhejiang University(Agriculture and Life Sciences), Vol. 33(2007), p. 562 (In Chinese) [3] Xiaoping Su, Jian Zhu, Lian Xu: Journal of Agricultural Mechanization Research, Vol. 32(2010), p. 36 (In Chinese) [4] Tao Chen.

Effects of Adding Form of Additives on the Structure and Properties of High-Purity Alumina Ceramics Qiang Ren, Xiu-lan Wu and Xuan-meng He School of Materials Science and Engineering, Shaanxi University of Science & Technology, Xianyang, Shaanxi, China Keywords: alumina ceramics, additive, sintering temperature, bending strength Abstract.
In comparison with sample introduced by oxide, sample introduced by nitrate had fine grains, smaller and lower pores and higher density structure, which helped to enhance the strength of materials.
Miao: Rare Metal materials and Engineering Vol. 32 (2003), pp. 53
Ye: Ordnance Material Science and Engineering Vol. 25(2002), pp. 68
Sun: Journal of the Chinese Rare Earth Society Vol. 20(2002), pp. 104.

Experiments Materials and apparatus The clinker digestion solution of the zinc oxide ore was used as raw material.
Advanced Materials Research, 239-242 (2011): 1743-1746
Materials Science and Engineering A (Structural Materials: Properties, Microstructure and Processing), 232 (2002): 356-361
Advanced Materials Research, 284-286(2011): 880-883
Materials Letters, 63 (2009): 242-245

High-speed video materials.
Journal of Materials Processing Technology, 214 (2014) 565-570
Journal of Materials Processing Technology, 249 (2017) 193-201
Journal of Materials Processing Technology, 248 (2017) 56-63
Journal of Materials Processing Technology, 249 (2017) 135-148